Abstract: A method of repairing a memory device may include collecting fail information on fail cells in a multi-block memory, classifying the fail cells into first and second types, and repairing the fail cells in the multi-block memory using one or more of a global spare memory, a local spare memory, and a common spare memory, based on the fail information.

Abstract: A method of repairing a memory device may include collecting fail information on fail cells in a multi-block memory, classifying the fail cells into first and second types, and repairing the fail cells in the multi-block memory using one or more of a global spare memory, a local spare memory, and a common spare memory, based on the fail information.

Abstract: A method to perform component testing by supplying test patterns to a serial input pin coupled to an IEEE 1149.6 boundary-scan cell that is associated with an IEEE 1149.6 test receiver. The test receiver is configured to operate in a scan test mode. The output from the test receiver circuit is coupled to a logic block to be scan tested. The output from the logic block is coupled to a serial output pin on the integrated circuit during scan test mode. High performance integrated circuits can use SerDes pins in a scan test mode to be scan tested without impacting mission critical signals.

Abstract: A method to perform component testing by supplying test patterns to a serial input pin coupled to an IEEE 1149.6 boundary-scan cell that is associated with an IEEE 1149.6 test receiver. The test receiver is configured to operate in a scan test mode. The output from the test receiver circuit is coupled to a logic block to be scan tested. The output from the logic block is coupled to a serial output pin on the integrated circuit during scan test mode. High performance integrated circuits can use SerDes pins in a scan test mode to be scan tested without impacting mission critical signals.

Abstract: Disclosed are, inter alia, methods, apparatus, data structures, computer-readable media, mechanisms, and means for providing a JTAG to system bus interface for accessing embedded analysis system(s). JTAG commands are received and converted into commands sent out a bus to a device including an embedded analysis instrument, with results received over the bus forwarded out the JTAG interface to an external device. Such a JTAG to system bus interface may eliminate the need to provide separate JTAG TAP interfaces on each ASIC of a board, and/or eliminate the need to daisy chain multiple TAP interfaces of multiple ASICs in order to provide a single TAP interface for accessing the multiple embedded testing instruments.

Abstract: Disclosed are, inter alia, methods, apparatus, data structures, computer-readable media, mechanisms, and means for providing a JTAG to system bus interface for accessing embedded analysis system(s). JTAG commands are received and converted into commands sent out a bus to a device including an embedded analysis instrument, with results received over the bus forwarded out the JTAG interface to an external device. Such a JTAG to system bus interface may eliminate the need to provide separate JTAG TAP interfaces on each ASIC of a board, and/or eliminate the need to daisy chain multiple TAP interfaces of multiple ASICs in order to provide a single TAP interface for accessing the multiple embedded testing instruments.

Abstract: Programmable test pattern driver and capture mechanisms for boundary scan cluster or functional block testing. A boundary scan test system includes at least one device under test. The device may include a Test Access Port (TAP) controller, a plurality of output AC boundary scan cells (BSCs), and a plurality of input AC BSCs. The device may further include a programmable AC_Pattern_Source signal generator configured to produce AC signal patterns that selectively remain unchanged for at least one cycle before and after an original capture cycle location, a programmable AC_Sync signal generator configured to independently control the AC_Sync signal to lead or lag an original cycle location at full cycle increments, a programmable phase controller configured to independently control either the rising or falling edge aligned AC_Pattern_Clock signal or AC_Counter_Clock signal, and an AC_Test_Clock signal switcher configured to selectively utilize one of a plurality of clock signals including a TCK signal.