Abstract: The present disclosure provides semiconductor structures and fabrication methods thereof. An exemplary semiconductor structure includes an insulation material layer having a top semiconductor layer having transistor regions formed on a top surface of the insulation material layer; isolation structures formed in the top semiconductor layer between adjacent transistor regions; a first dielectric layer formed over the top semiconductor layer; a first heat-conducting layer having a thermal conductivity higher than a thermal conductivity of the isolation structure and passing through the insulation material layer, the top semiconductor layer and the first dielectric layer; a second dielectric layer formed over the first dielectric layer; an interconnect structure formed in the second dielectric layer; and a bottom layer conductive via passing through the heat-conducting layer and a partial thickness of the second dielectric layer, and electrically connected with the interconnect structure.

Abstract: The present disclosure provides semiconductor structures and fabrication methods thereof. An exemplary semiconductor structure includes an insulation material layer having a top semiconductor layer having transistor regions formed on a top surface of the insulation material layer; isolation structures formed in the top semiconductor layer between adjacent transistor regions; a first dielectric layer formed over the top semiconductor layer; a first heat-conducting layer having a thermal conductivity higher than a thermal conductivity of the isolation structure and passing through the insulation material layer, the top semiconductor layer and the first dielectric layer; a second dielectric layer formed over the first dielectric layer; an interconnect structure formed in the second dielectric layer; and a bottom layer conductive via passing through the heat-conducting layer and a partial thickness of the second dielectric layer, and electrically connected with the interconnect structure.

Abstract: A feeding device includes a guiding assembly and a clamping mechanism. The guiding assembly includes a guiding rod and a transfer rod coupled to the guiding rod. The transfer rod includes a rack. The clamping mechanism includes a driving assembly and a clamping assembly. The driving assembly includes a support frame, a first driver coupled to the support frame, a gear coupled to the first driver and meshing with the rack, and two guiding members adjustably coupled to the support frame and positioned at opposite sides of the guiding rod. The guiding members is latched to the guiding rod and configured to move the support frame to adjust a backlash between the gear and the rack. The clamping assembly is coupled to the support frame.

Abstract: A feeding device includes a guiding assembly and a clamping mechanism. The guiding assembly includes a guiding rod and a transfer rod coupled to the guiding rod. The transfer rod includes a rack. The clamping mechanism includes a driving assembly and a clamping assembly. The driving assembly includes a support frame, a first driver coupled to the support frame, a gear coupled to the first driver and meshing with the rack, and two guiding members adjustably coupled to the support frame and positioned at opposite sides of the guiding rod. The guiding members is latched to the guiding rod and configured to move the support frame to adjust a backlash between the gear and the rack. The clamping assembly is coupled to the support frame.

Abstract: A handling device includes a support seat defining an inserting hole, a first driving member, and a handling assembly. The first driving member is assembled to the support seat and is aligned with the inserting hole. The handling assembly includes a mounting seat, a transmission subassembly, a second driving member, and a suction subassembly. The mounting seat is assembled to a side of the support seat opposite to the first driving member, the mounting seat is adjacent to the inserting hole. The transmission subassembly is assembled to the support seat. The second driving member is assembled to the mounting seat and connected to the transmission subassembly. The suction subassembly is assembled to the transmission subassembly. Wherein the first driving member extends through the inserting hole and supports a workpiece, the suction subassembly sucks the workpiece, the second driving member drives the transmission subassembly to handle the workpiece to a workstation.