Abstract: An optical device includes a substrate. a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.

Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Abstract: An optical device includes a substrate. a non-planar transparent structure on a first surface of the substrate, the non-planar transparent structure being made of a first material, and a molded refractive surface on the first surface of the substrate adjacent the non-planar transparent structure, the molded refractive surface being made of a second material, different from the first material.

Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.

Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Abstract: A camera system may include an optics stack including first and second substrates secured together in a stacking direction, one of the first and seconds substrates including an optical element, a detector on a sensor substrate, and a feature reducing an amount of light entering at an angle greater than a field of view of the camera system from reaching the detector, the feature being on another of the first and second substrates.

Abstract: A camera system may include an optics stack including two substrates secured together in a vertical direction and an optical system on the two substrates, the two substrates having exposed sides, a detector on a detector substrate, and a stray light blocker directly on at least some sides of the optics stack.

Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.

Abstract: A waveguide to waveguide monitor includes an optics block between the two waveguides. The optics block couples light between the two waveguides and includes at least two parallel surfaces. The monitor also has an optical tap which creates a monitor beam. The optics block may be flush with the endfaces of the waveguides, even if the endfaces are angled. At least two optical elements needed to couple the light between the two optical waveguides and direct the monitor beam on a detector are on the at least two parallel surfaces of the optics block and any surfaces secured thereto.

Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.

Abstract: Etching in combination with other processing techniques is used to facilitate alignment of an optical die in an optical system. The optical dies are formed on a wafer level and need to be singulated for use in the optical system. The formation of a precise edge from etching allows more accurate alignment of the optical die in the optical system. The other processing techniques include dicing, sawing, cleaving, breaking and thinning.

Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.

Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.

Abstract: A thick wafer is diced by partially dicing a first side to form a first dice, flipping the wafer so that the first side is now in contact with a dicing tape, and dicing a second side. The dicing of the second side may be achieved by aligning a dicing tool to the first dice and/or alignment marks on the wafer. The thick wafer may be a composite wafer including two or more wafers bonded together. These two wafers may be different thicknesses and/or different materials.