Abstract: An optical module includes an upper shell, a lower shell, a circuit board, and a light-emitting device. The circuit board includes a mounting hole running through a front surface and a back surface of the circuit board. The light-emitting device includes a base, a laser assembly, a translation prism, and an optical fiber coupler. The base is installed on the front surface and has an installation surface facing towards the front surface. The laser assembly and the translation prism are installed on the installation surface. The laser assembly passes through the mounting hole. The translation prism is configured to translate a laser beam located at the back side of the circuit board emitted by the laser assembly to the front side of the circuit board. The optical fiber coupler is configured to transmit the translated laser beam to outside of the optical module.

Abstract: An optical module includes a shell, a circuit board, a light-emitting device, a sensor assembly and a processor. The circuit board is disposed in the shell. The light-emitting device is disposed in the shell, and includes a non-hermetically sealed cover, a laser chip and a thermo electric cooler. The thermo electric cooler is disposed in the cover and is configured to adjust a temperature of the heat exchange surface of the thermo electric cooler connected to the laser chip. The sensor assembly is disposed on the circuit board and is configured to detect ambient data inside the optical module, the ambient data including at least ambient humidity. The processor is disposed on the circuit board, and is configured to receive the ambient data detected by and sent from the sensor assembly, and control the thermo electric cooler to adjust the temperature of the heat exchange surface of the thermo electric cooler to a target temperature according to the ambient data.