Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can be deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can be deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can be deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can be deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can he deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.

Abstract: Embodiments are directed to managing shared certificates of a role certificate store, accessing and implementing certificates provided by a role certificate store and to managing role-based shared certificates using a role certificate store. In one scenario, a computer system establishes a role certificate store. The role certificate store is configured to store role-based shared certificates, where each role-based shared certificate corresponds to instances of a specified role. The computer system receives a request for a role-based shared certificate from an instance of the specified role, where the request is redirected from a local data store to the role certificate store. The computer system then verifies that the request was received from an instance of the specified role and sends the requested role-based shared certificate to the role instance.

Abstract: An apparatus for assembling a post-CMP cleaning brush. The post-CMP cleaning brush is provided with a brush core and an outer brush, and the outer brush is provided with a hollow portion. The apparatus comprises a base, a fixed member, a sliding member, a plurality of posts, and an actuating device. The base holds the brush core and the outer brush, and the fixed member is disposed on the base. The sliding member is disposed on the base in a manner such that it is located at the opposite side of the fixed member relative to the outer brush disposed on the base. The posts, disposed on the sliding member, pass through the fixed member and the hollow portion of the outer brush so as to assist the brush core in passing through the hollow portion of the outer brush. The actuating device connects with the brush core so as to pass the brush core through the hollow portion of the outer brush and separate the posts, inserted into the outer brush, from the outer brush.

Abstract: An apparatus for assembling a post-CMP cleaning brush. The post-CMP cleaning brush is provided with a brush core and an outer brush, and the outer brush is provided with a hollow portion. The apparatus comprises a base, a fixed member, a sliding member, a plurality of posts, and an actuating device. The base holds the brush core and the outer brush, and the fixed member is disposed on the base. The sliding member is disposed on the base in a manner such that it is located at the opposite side of the fixed member relative to the outer brush disposed on the base. The posts, disposed on the sliding member, pass through the fixed member and the hollow portion of the outer brush so as to assist the brush core in passing through the hollow portion of the outer brush. The actuating device connects with the brush core so as to pass the brush core through the hollow portion of the outer brush and separate the posts, inserted into the outer brush, from the outer brush.