Patents by Inventor Hong-Wei Du

Hong-Wei Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation device with a heat pipe
    Patent number: 7312994
    Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: December 25, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu, Bing-Wen Zhou, Hong-Wei Du
  • Heat dissipation device with a heat pipe
    Publication number: 20060158850
    Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
    Type: Application
    Filed: October 6, 2005
    Publication date: July 20, 2006
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu, Bing-Wen Zhou, Hong-Wei Du