Abstract: The application provides a high-purity thermostable crystal form of a substituted 3-isoxazolidinone compound, a preparation method therefor and an application thereof. The High-purity thermostable crystal form is prepared by a particular method of the present technology and is determined by single-crystal X-ray diffraction as an orthorhombic crystal, featuring a space group of P212121 and lattice parameters of a=9.2301(2) ?, b=11.0751(3) ?, c=12.7554(3) A, ?=90°, ?=90°, and ?=90°. The orthorhombic crystal can be conveniently applied in preparation of agrochemical formulations, such as a suspension concentrate and a water dispersible granule, and the new formulations prepared have a better herbicidal activity and crop safety.

Abstract: A multi-system, multi-parameter, integrated, comprehensive early warning method for a coal and rock dynamic disaster includes: obtaining monitoring data of a plurality of monitoring systems for the coal rock dynamic disaster, and extracting multivariate characteristic parameters capable of reflecting precursor information of the coal and rock dynamic disaster in each monitoring system based on the monitoring data; screening out a combination of characteristic parameters with a highest early warning effectiveness in each monitoring system and an optimal critical value of each characteristic parameter based on the multivariate characteristic parameters; calculating a comprehensive early warning index and an early warning effectiveness of each monitoring system; and calculating a multi-system comprehensive early warning result of the coal and rock dynamic disaster based on the comprehensive early warning index and the early warning effectiveness of each monitoring system.

Abstract: A multi-system, multi-parameter, integrated, comprehensive early warning method for a coal and rock dynamic disaster includes: obtaining monitoring data of a plurality of monitoring systems for the coal rock dynamic disaster, and extracting multivariate characteristic parameters capable of reflecting precursor information of the coal and rock dynamic disaster in each monitoring system based on the monitoring data; screening out a combination of characteristic parameters with a highest early warning effectiveness in each monitoring system and an optimal critical value of each characteristic parameter based on the multivariate characteristic parameters; calculating a comprehensive early warning index and an early warning effectiveness of each monitoring system; and calculating a multi-system comprehensive early warning result of the coal and rock dynamic disaster based on the comprehensive early warning index and the early warning effectiveness of each monitoring system.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: The present disclosure provides an optical module. The optical module of the present disclosure may include: a base, the base being provided with a fixing part configured to place a lens; the lens located in the fixing part; and a laser, located on the base, the laser being configured to transmit an optical signal to the lens, where fixing adhesive is filled symmetrically in gaps between two symmetric sides of the lens and the fixing part.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: An optical component includes: a first substrate, a second substrate, and a transfer board. A first electrically conductive path is disposed on a top surface of the first substrate. A second electrically conductive path is disposed on a bottom surface of the first substrate. A third electrically conductive path is disposed on a top surface of the second substrate. A microstrip line structure is disposed on the transfer board. The microstrip line structure includes a transfer line disposed on a top surface of the transfer board. The top surface of the second substrate is opposite to the bottom surface of the first substrate, where the second electrically conductive path fits the third electrically conductive path. The transfer board is disposed on the top of the top surface of the second substrate. One end of the transfer line is electrically connected to the first electrically conductive path by a wire bonding.

Abstract: The present disclosure provides an optical module. The optical module of the present disclosure may include: a base, the base being provided with a fixing part configured to place a lens; the lens located in the fixing part; and a laser, located on the base, the laser being configured to transmit an optical signal to the lens, where fixing adhesive is filled symmetrically in gaps between two symmetric sides of the lens and the fixing part.

Abstract: A connection structure for a laser and a laser assembly are provided. The connection structure for a laser includes a first insulation substrate, where the first insulation substrate includes a conductive path separately on an upper surface and a lower surface thereof. A second insulation substrate is disposed on the upper surface of the first insulation substrate. An upper surface of the second insulation substrate includes a conductive path. The conductive path on the upper surface of the second insulation substrate is electrically connected to the conductive path on the lower surface of the first insulation substrate via a through-hole. The connection structure for a laser and the laser assembly in the present disclosure are configured to supplying power to a laser.

Abstract: A laser transmitter includes a heat sink, a laser disposed on the heat sink, and a connection apparatus. The connection apparatus includes: a lower substrate and an upper substrate disposed on the lower substrate. An upper surface of the lower substrate is disposed with a first conductor, and a lower surface thereof is disposed with a second conductor. The upper substrate has an upper surface disposed with a third conductor, where the third conductor is connected to the second conductor. The heat sink is disposed on a side of the lower substrate that is close to an end of the first conductor. The laser is connected to an end of the first conductor that is close to the heat sink.