Abstract: Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.

Abstract: An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, organic dielectric material over the plurality of interconnect layers, copper pads on a surface of a cavity within the organic dielectric material, an integrated circuit bridge device coupled with the copper pads, wherein a surface of the integrated circuit bridge device is elevated above an opening of the cavity, underfill material between the integrated circuit bridge device and the surface of the cavity, and build-up layers formed over the organic dielectric material around the integrated circuit bridge device. Other embodiments are also disclosed and claimed.

Abstract: Embodiments disclosed herein include package substrates with a glass core. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface, and the substrate is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, where the opening comprises a sidewall that is non-orthogonal with the first surface of the substrate. In an embodiment a corner at a junction between the sidewall and the first surface is rounded. In an embodiment, a via is provided in the opening, where the via is electrically conductive.

Abstract: A device comprises a substrate comprising a plurality of build-up layers and a cavity. A bridge die is located within the cavity and a plurality of cavity side bumps are on one side of the bridge die. A plurality of interconnect pads with variable heights are on one of the build-up layers of the substrate coupled to the plurality of the cavity side bumps to bond the bridge die to the substrate.

Abstract: Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.

Abstract: Glass cores including protruding through glass vias and related methods are disclosed herein. An example substrate disclosed herein includes a glass core including a surface and a copper through glass via (TGV) extending through the glass core, the TGV including a protrusion extending from the surface.

Abstract: Provided are a CT scanning method and system, an electronic device, and a computer-readable storage medium. The method includes: determining a first coordinate of a mark point of a part to be imaged in a dual-camera coordinate system; converting the first coordinate into a second coordinate of the mark point in a CT coordinate system according to coordinate system transformation parameters; generating first locating information according to the second coordinate to drive a scanning table to move to a first location designated by the first locating information; obtaining projection images of the part to be scanned; determining second locating information and scanning information of the part to be scanned according to the projection images; and driving the scanning table to move to a second location designated by the second locating information according to the second locating information and performing CT scanning according to the scanning information.

Abstract: Processes and structures resulting therefrom for the improvement of high speed signaling integrity in electronic substrates of integrated circuit packages, which is achieved with the formation of airgap structures within dielectric material(s) between adjacent conductive routes that transmit/receive electrical signals, wherein the airgap structures decrease the capacitance and/or decrease the insertion losses in the dielectric material used to form the electronic substrates.

Abstract: The present invention provides a model for high-throughput screening of endocrine disruptors and a method for screening the same. In the present invention, primary structural alerts, secondary structural alerts and tertiary structural alerts of compounds are extracted according to a nuclear receptor, and then the primary structural alerts, the secondary structural alerts and the tertiary structural alerts form a nuclear receptor high-throughput screening model; hierarchical structural alert matching is carried out on target compounds through the nuclear receptor high-throughput screening model, and ligand-receptor binding mode analysis and semi-quantitative prediction of binding activity and disrupting activity are performed.

Abstract: A microwave heat treatment method for granulated blast furnace slag is provided, which includes the following steps: subjecting the granulated blast furnace slag to microwave heat treatment at a frequency of 900-930 MHz and then cooling the slag. Microwave rapid heating is utilized to remove the moisture in the granulated blast furnace slag, stress is generated inside the granulated blast furnace slag particles to promote the formation of cracks or the decomposition of the granulated slag particles into small particles. After the microwave reaches a certain power, the microwave is turned off, an air blower is turned on, and thermal stress is generated inside the granulated blast furnace slag particles, so that the particles are further promoted to generate cracks or fragmentation; and then the desired fine powder can be obtained by ball milling the granulated blast furnace slag after microwave heat treatment for a short time.

Abstract: Systems and methods for monitoring isolation resistance of individual batteries in a battery bank enable measurement of isolation resistance to be performed for different batteries at different times, thereby preventing the measurements from interfering with each other. In some embodiments, each battery in a battery bank has a battery monitoring system controller, and each battery monitoring system controller operates independently of the other battery monitoring system controllers in the battery bank. Each battery monitoring system controller can perform measurements of isolation resistance at regular intervals. Each battery monitoring system controller determines a start time for its measurements in a manner such that no two controllers perform isolation resistance measurements at the same time.

Abstract: Provided is a bullet-proof and stab-proof material. The bullet-proof and stab-proof material includes an impact-resistant layer and a cutting-resistant, bullet-proof and energy-absorbing layer, where the impact-resistant layer is one or more Kevlar fiber-based unidirectional (UD) sheets; and the cutting-resistant, bullet-proof and energy-absorbing layer is formed by stacking a plurality of the Kevlar fiber-based UD sheets and/or a plurality of ultra-high-molecular-weight polyethylene (UHMWPE) fiber-based UD sheets, or by stacking a plurality of Kevlar/UHMWPE hybrid fiber-based UD sheets.

Abstract: A power delivery system includes a controller, configured to receive a voltage indication signal indicating a measured voltage of a battery management system and to determine whether first and second diodes of the battery management system are faulty based on the voltage indication signal. The controller is also configured to respectively receive first and second current indication signals from first and second current sensors of the battery management system and to determine whether the first and second diodes of the first battery management system are faulty based on the first and second current indication signals.