Patents by Inventor Hongxia DENG

Hongxia DENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113065
    Abstract: In some examples, a semiconductor package comprises an electrically conductive surface and a bond wire coupled to the electrically conductive surface. The bond wire includes a first stitch bond coupled to the electrically conductive surface, and a second stitch bond contiguous with the first stitch bond and coupled to the electrically conductive surface. The second stitch bond is partially, but not completely, overlapping with the first stitch bond.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Xiaolin KANG, Ziqi WANG, Huoyun DUAN, Peng PENG, Ye ZHUANG, Xiaoling KANG, Hongxia DENG
  • Patent number: 11924371
    Abstract: A content sending method includes: a server obtains video media content and additional information content, indicates a calling terminal to complete resource reservation for transmitting the video media content and the additional information content, transmits the video media content to a first port set of the calling terminal, and transmits the additional information content to a second port set of the calling terminal. In this way, two types of content streams are transmitted to the calling terminal by using channels of the two port sets, and a function of providing an additional service in a process of playing a video ring back tone is implemented.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: March 5, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hongxia Hao, Zhilei Deng