Abstract: A tetravalent dengue inactivated vaccine is provided, including a DENV-1 inactivated antigen, a DENV-2 inactivated antigen, a DENV-3 inactivated antigen, and a DENV-4 inactivated antigen. The tetravalent dengue inactivated vaccine with a good immune effect is prepared by using four serotypes of dengue viruses as virus seeds. Furthermore, the tetravalent dengue inactivated vaccine is capable of being preserved at 4° C. for a long time, possesses lasting and effective immunogenicity, produces higher antibody titer in mice and non-human primates, has good challenge protection capability on suckling mice, has no reproductive toxicity in the mice, and has good safety.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.

Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core comprises a first surface and a second surface opposite the first surface, and a first sidewall between the first surface and the second surface. The glass core may include a conductor within a through-glass via extending from the first surface to the second surface and a build-up layer. The glass cord comprises a plurality of first areas of the glass core and a plurality of laser-treated areas on the first sidewall. A first one of the plurality of laser-treated areas may be spaced away from a second one of the plurality of laser-treated areas. A first area may comprise a first nanoporosity and a laser-treated area may comprise a second nanoporosity, wherein the second nanoporosity is greater than the first nanoporosity.

Abstract: Conductive structures in a microelectronic package and having a surface roughness of 50 nm or less are described. This surface roughness is from 2 to 4 times less than can be found in packages with conductive structures (e.g., traces) formed using alternative techniques. This reduced surface roughness has a number of benefits, which in some cases includes a reduction of insertion loss and improves a signal to noise ratio for high frequency computing applications. The reduced surface roughness can be accomplished by protecting the conductive structure r during etch processes and applying an adhesion promoting layer to the conductive structure.

Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.

Abstract: This invention relates to a method for preparing a star-shaped polycarboxylate superplasticizer by the first esterification step with polyol and (meth)acrylic acid as main reactants and the second polymerization step. In the first step, the star-shaped polymerizable active ends were synthesized by esterification between polyol and (meth)acrylic acid in the presence of catalyst. In the second step, the final star-shaped polycarboxylate superplasticizer was prepared by radical polymerization among the product obtained in first step, unsaturated polyoxyethylene ethers, molecular weight regulator and unsaturated carboxylic acid in the presence of initiator. The production process of this invention exhibits some characteristics including simple, easily controllable, high polymerization degree, low cost and pollution free. The star-shaped molecular structure of polycarboxylate superplasticizer can be achieved through synthesizing active “core” by esterification and “arm” by radical polymerization.

Abstract: This invention relates to a method for preparing a star-shaped polycarboxylate superplasticizer by the first esterification step with polyol and (meth)acrylic acid as main reactants and the second polymerization step. In the first step, the star-shaped polymerizable active ends were synthesized by esterification between polyol and (meth)acrylic acid in the presence of catalyst. In the second step, the final star-shaped polycarboxylate superplasticizer was prepared by radical polymerization among the product obtained in first step, unsaturated polyoxyethylene ethers, molecular weight regulator and unsaturated carboxylic acid in the presence of initiator. The production process of this invention exhibits some characteristics including simple, easily controllable, high polymerization degree, low cost and pollution free. The star-shaped molecular structure of polycarboxylate superplasticizer can be achieved through synthesizing active “core” by esterification and “arm” by radical polymerization.