Patents by Inventor Hongyang Liu

Hongyang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11675148
    Abstract: An optical-path-displacement-compensation-based emission optical power stabilization assembly, comprising: a laser, a lens, and an optical fiber coupling port disposed on a first substrate and a second substrate according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate is larger than that of the first substrate, and the preset arrangement scheme enables initial distances between the laser and the lens, between the lens and the optical fiber coupling port, and/or between the laser and the optical fiber coupling port to differ from respective optical coupling distances from an optical coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature, forming a complementary effect with respect to an optical power-temperature curve of the laser, which reduces a temperature-caused fluctuation of the emission optical power of an optical assembly.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: June 13, 2023
    Inventors: Hu Zhu, Shujian Du, Yanling Guo, Hongyang Liu, Rikai Zhou, Yongan Fu, Liping Sun
  • Publication number: 20220252799
    Abstract: An optical-path-displacement-compensation-based emission optical power stabilization assembly, comprising: a laser, a lens, and an optical fiber coupling port disposed on a first substrate and a second substrate according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate is larger than that of the first substrate, and the preset arrangement scheme enables initial distances between the laser and the lens, between the lens and the optical fiber coupling port, and/or between the laser and the optical fiber coupling port to differ from respective optical coupling distances from an optical coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature, forming a complementary effect with respect to an optical power-temperature curve of the laser, which reduces a temperature-caused fluctuation of the emission optical power of an optical assembly.
    Type: Application
    Filed: December 13, 2019
    Publication date: August 11, 2022
    Applicant: Accelink Technologies Co., Ltd.
    Inventors: Hu Zhu, Shujian Du, Yanling Guo, Hongyang Liu, Rikai Zhou, Yongan Fu, Liping Sun
  • Patent number: 10882887
    Abstract: Provided is a papillomavirus chimeric protein, the skeleton thereof being a papillomavirus L1 protein or a mutant thereof, at least one human papillomavirus 33-type L2 protein or mutant polypeptide thereof being embedded on the skeleton. The present papillomavirus chimeric protein can be used for preparing a vaccine for preventing papillomavirus infections and infection induced disease.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: January 5, 2021
    Assignee: INSTITUTEOF BASIC MEDICAL SCIENCES, CHINESE ACADEMY OF MEDICAL SCIENCES
    Inventors: Xuemei Xu, Xue Chen, Ting Zhang, Zhirong Wang, Hongyang Liu, Shuo Wang, Meili Hu
  • Publication number: 20190031724
    Abstract: Provided is a papillomavirus chimeric protein, the skeleton thereof being a papillomavirus L1 protein or a mutant thereof, at least one human papillomavirus 33-type L2 protein or mutant polypeptide thereof being embedded on the skeleton. The present papillomavirus chimeric protein can be used for preparing a vaccine for preventing papillomavirus infections and infection induced disease.
    Type: Application
    Filed: March 2, 2017
    Publication date: January 31, 2019
    Inventors: Xuemei XU, Xue CHEN, Ting ZHANG, Zhirong WANG, Hongyang LIU, Shuo WANG, Meili HU
  • Patent number: 10106709
    Abstract: A single-component conductive adhesive with low hardness, and method of manufacture and use are provided. The conductive adhesive may include a resin composition, an organic solvent and nickel-coated graphite powder. The weight ratio of the resin composition to nickel-coated graphite powder may be 20%:80% or 40%:60%. The weight of the organic solvent may be 20-40% the weight of the resin composition. The resin composition may include 20-40% by weight of vinyl-terminated polydimethylsiloxane (PDMS), 5-15% by weight of H—Si polysiloxane oil, 0.05-0.15% by weight of polymerization inhibitor, and 0.1-1% by weight of encapsulated platinum complex.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: October 23, 2018
    Assignee: Dongguan Nystein Electronic Materials Co., LTD.
    Inventor: Hongyang Liu
  • Publication number: 20180022969
    Abstract: A single-component conductive adhesive with low hardness, and method of manufacture and use are provided. The conductive adhesive may include a resin composition, an organic solvent and nickel-coated graphite powder. The weight ratio of the resin composition to nickel-coated graphite powder may be 20%: 80% or 40%: 60%. The weight of the organic solvent may be 20-40% the weight of the resin composition. The resin composition may include 20-40% by weight of vinyl-terminated polydimethylsiloxane (PDMS), 5-15% by weight of H-Si polysiloxane oil, 0.05-0.15% by weight of polymerization inhibitor, and 0.1-1% by weight of encapsulated platinum complex.
    Type: Application
    Filed: June 9, 2017
    Publication date: January 25, 2018
    Applicant: Dongguan Nystein Electronic Materials Co., LTD.
    Inventor: Hongyang Liu