Abstract: A welding strip carrier film. The raw materials for the welding strip carrier film comprise, in percent by mass, 50-99% of a matrix resin, 0-50% of a tackifying resin, and 0-5% of an additive. The matrix resin is one or more of a polyolefin resin and an elastomer thereof, a polyester resin and an elastomer thereof, polyvinyl butyral, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid copolymer, an ionic polymer, polyamide, fluororesin, and modifiers thereof. The tackifying resin is one or more of rosin, hydrogenated rosin, a petroleum resin, a hydrogenated petroleum resin, a phenolic resin, and a terpene resin. The carrier film can be manufactured into a single-layer structure, and thus can have a support function while ensuring its bonding performance to a welding strip and a cell; and the carrier film would not be penetrated by a welding strip during lamination.

Abstract: The present disclosure relates to an encapsulation adhesive film for a solar cell, comprising a transparent layer in contact with a cell sheet, and a first adhesive film layer in contact with the transparent layer, wherein raw materials of the first adhesive film layer comprise the following components: a resin and a colored filler with a mass ratio of 3 to 25:1, a cross-linking agent accounting for 0.1% to 5% of the total mass of the resin and the colored filler, an auxiliary cross-linking agent accounting for 0.1% to 1% of the total mass of the resin and the colored filler, a coupling agent accounting for 0.1% to 1% of the total mass of the resin and the colored filler, a light stabilizer accounting for 0.1% to 1% of the total mass of the resin and the colored filler, and a photo initiator accounting for 0.1% to 5% of the total mass of the resin and the colored filler. The present disclosure can effectively prevent a white substance from overflowing.

Abstract: The present invention discloses a co-extruded one-time-formed solar cell module backboard in a three-layer structure. The backboard is formed by co-extruding three layers: a middle layer located in the middle as well as an outer layer and an inner layer located at two sides of the middle layer, and has high water resisting capability, high reflective rate, good long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance and good recoverability and environmental protection performance. Compared with the prior art, the backboard has better water resisting ability, higher reflectivity, better long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance, better recoverability and environmental protection performance and lower cost. Compared with a backboard in a co-extruded structure in the prior art, the backboard of the present invention has better heat resistance, better dimensional stability and higher mechanical breaking strength.

Abstract: Disclosed is a high-performance repair tape for a backboard of a photovoltaic module. The tape comprises a base material layer, a functional adhesive layer, and a release material layer provided in sequence from top to bottom; the base material layer is formed of a polyester thin film material; the functional adhesive layer is formed of a high weather-resistance adhesive.

Abstract: The present invention discloses a co-extruded one-time-formed solar cell module backboard in a three-layer structure. The backboard is formed by co-extruding three layers: a middle layer located in the middle as well as an outer layer and an inner layer located at two sides of the middle layer, and has high water resisting capability, high reflective rate, good long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance and good recoverability and environmental protection performance. Compared with the prior art, the backboard has better water resisting ability, higher reflectivity, better long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance, better recoverability and environmental protection performance and lower cost. Compared with a backboard in a co-extruded structure in the prior art, the backboard of the present invention has better heat resistance, better dimensional stability and higher mechanical breaking strength.