Patents by Inventor Hongyeal LEE

Hongyeal LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic bandgap structure and method for manufacturing the same
    Patent number: 10237969
    Abstract: Disclosed are an electromagnetic bandgap structure and a method for manufacturing the same. The electromagnetic bandgap structure includes a ground layer, a middle layer configured to include one or more patches, and to face the ground layer with a first dielectric layer interposed between the middle layer and the ground layer, wherein the first dielectric layer is stacked on a top of the ground layer, and a power layer configured to face the middle layer with a second dielectric layer interposed between the power layer and the middle layer, wherein the second dielectric layer is stacked on a top of the patches, wherein the patches and the power layer are electrically connected to each other through a via.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: March 19, 2019
    Assignee: Electronics and Telecommunications Research Institute
    Inventor: Hongyeal Lee
  • ELECTROMAGNETIC BANDGAP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180070441
    Abstract: Disclosed are an electromagnetic bandgap structure and a method for manufacturing the same. The electromagnetic bandgap structure includes a ground layer, a middle layer configured to include one or more patches, and to face the ground layer with a first dielectric layer interposed between the middle layer and the ground layer, wherein the first dielectric layer is stacked on a top of the ground layer, and a power layer configured to face the middle layer with a second dielectric layer interposed between the power layer and the middle layer, wherein the second dielectric layer is stacked on a top of the patches, wherein the patches and the power layer are electrically connected to each other through a via.
    Type: Application
    Filed: March 8, 2017
    Publication date: March 8, 2018
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTIT UTE
    Inventor: Hongyeal LEE