Patents by Inventor Hongyu Bai

Hongyu Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230238178
    Abstract: Coils for superconducting magnets and methods of making coils for superconducting magnets and controlling the turn-to-turn contact resistance of coils. The coils include a REBCO superconducting tape coated with a layer of tin-lead solder, co-wound with an oxidized stainless steel tape. The inclusion of tin-lead solder on the REBCO tape and a layer of oxidation on the stainless steel tape advantageously allow for tuning of the turn-to-turn contact resistance of the coil, and advantageously mitigates the effect of repeated pressure cycling on the turn-to-turn contact resistance.
    Type: Application
    Filed: January 20, 2023
    Publication date: July 27, 2023
    Inventors: Jun Lu, Iain R. Dixon, Mark D. Bird, Justin Deterding, Hongyu Bai, Emsley L. Marks, William Denis Markiewicz
  • Publication number: 20120137707
    Abstract: An apparatus for transferring cryogenic refrigeration includes a cryocooler interface, a housing, a working fluid, a heat exchanger, a flexible thermal link, and a remote cartridge cold head. The cryocooler interface is thermally connected to a cryocooler providing a source of refrigeration. The refrigeration is passed from the crycooler into the heat exchanger via the cryocooler interface. The remote cartridge cold head is attached to a remote location. Heat is drawn from the remote location through the remote cartridge cold head and into the heat exchanger via the working fluid within the flexible thermal link and housing. Within the heat exchanger, heat is transferred from the working fluid to the refrigeration source, such as a cryocooler; accordingly, the remote location is cooled.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 7, 2012
    Applicants: Korea Basic Science Institute, The Florida State University Research Foundation, Inc.
    Inventors: Thomas Andrew Painter, Yeon Suk Choi, Dong Lak Kim, Hongyu Bai