Patents by Inventor Hongyu H. YUE

Hongyu H. YUE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-step location specific process for substrate edge profile correction for GCIB system
    Patent number: 9502209
    Abstract: Disclosed are an apparatus, system, and method for scanning a substrate or other workpiece through a gas-cluster ion beam (GCIB), or any other type of ion beam. The workpiece scanning apparatus is configured to receive and hold a substrate for irradiation by the GCIB and to scan it through the GCIB in two directions using two movements: a reciprocating fast-scan movement, and a slow-scan movement. The slow-scan movement is actuated using a servo motor and a belt drive system, the belt drive system being configured to reduce the failure rate of the workpiece scanning apparatus.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: November 22, 2016
    Assignee: TEL Epion Inc.
    Inventors: Hongyu H. Yue, Noel Russell, Vincent Gizzo, Joshua LaRose, Steven P. Caliendo
  • MULTI-STEP LOCATION SPECIFIC PROCESS FOR SUBSTRATE EDGE PROFILE CORRECTION FOR GCIB SYSTEM
    Publication number: 20150348746
    Abstract: Disclosed are an apparatus, system, and method for scanning a substrate or other workpiece through a gas-cluster ion beam (GCIB), or any other type of ion beam. The workpiece scanning apparatus is configured to receive and hold a substrate for irradiation by the GCIB and to scan it through the GCIB in two directions using two movements: a reciprocating fast-scan movement, and a slow-scan movement. The slow-scan movement is actuated using a servo motor and a belt drive system, the belt drive system being configured to reduce the failure rate of the workpiece scanning apparatus.
    Type: Application
    Filed: August 10, 2015
    Publication date: December 3, 2015
    Inventors: Hongyu H. Yue, Noel Russell, Vincent Gizzo, Joshua LaRose, Steven P. Caliendo
  • Multi-step location specific process for substrate edge profile correction for GCIB system
    Patent number: 9105443
    Abstract: Disclosed are an apparatus, system, and method for scanning a substrate or other workpiece through a gas-cluster ion beam (GCIB), or any other type of ion beam. The workpiece scanning apparatus is configured to receive and hold a substrate for irradiation by the GCIB and to scan it through the GCIB in two directions using two movements: a reciprocating fast-scan movement, and a slow-scan movement. The slow-scan movement is actuated using a servo motor and a belt drive system, the belt drive system being configured to reduce the failure rate of the workpiece scanning apparatus.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: August 11, 2015
    Assignee: TEL Epion Inc.
    Inventors: Hongyu H. Yue, Noel Russell, Vincent Gizzo, Joshua LaRose, Steven P. Caliendo
  • MULTI-STEP LOCATION SPECIFIC PROCESS FOR SUBSTRATE EDGE PROFILE CORRECTION FOR GCIB SYSTEM
    Publication number: 20150137006
    Abstract: Disclosed are an apparatus, system, and method for scanning a substrate or other workpiece through a gas-cluster ion beam (GCIB), or any other type of ion beam. The workpiece scanning apparatus is configured to receive and hold a substrate for irradiation by the GCIB and to scan it through the GCIB in two directions using two movements: a reciprocating fast-scan movement, and a slow-scan movement. The slow-scan movement is actuated using a servo motor and a belt drive system, the belt drive system being configured to reduce the failure rate of the workpiece scanning apparatus.
    Type: Application
    Filed: November 20, 2014
    Publication date: May 21, 2015
    Inventors: Hongyu H. Yue, Noel Russell, Vincent Gizzo, Joshua LaRose, Steven P. Caliendo
  • Electrochemical substrate slicing using electromagnetic wave excitation
    Patent number: 8444848
    Abstract: An apparatus for cutting a workpiece using electrochemical etching and a method of using thereof are described. The apparatus includes an electrochemical bath configured to contain an electrochemical solution, a support apparatus configured to support and immerse a workpiece in the electrochemical bath, and a non-contact cutting device configured to extend into the electrochemical bath and slice the workpiece via electrochemical etching along a cutting plane. The apparatus further includes an electromagnetic (EM) radiation source configured to illuminate a cutting surface formed between opposing sidewalls within an evolving cutting groove formed in the workpiece during slicing along the cutting plane.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: May 21, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Hongyu H. Yue, Junjun Liu, Dorel I. Toma
  • Electrochemical substrate slicing using electromagnetic wave excitation
    Publication number: 20110186443
    Abstract: An apparatus for cutting a workpiece using electrochemical etching and a method of using thereof are described. The apparatus includes an electrochemical bath configured to contain an electrochemical solution, a support apparatus configured to support and immerse a workpiece in the electrochemical bath, and a non-contact cutting device configured to extend into the electrochemical bath and slice the workpiece via electrochemical etching along a cutting plane. The apparatus further includes an electromagnetic (EM) radiation source configured to illuminate a cutting surface formed between opposing sidewalls within an evolving cutting groove formed in the workpiece during slicing along the cutting plane.
    Type: Application
    Filed: February 1, 2010
    Publication date: August 4, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Hongyu H. YUE, Junjun LIU, Dorel I. TOMA