Abstract: Disclosed are a stress-resistant, creep-resistant, high-temperature resistant and high-insulation sheath material for a maglev train cable, and a manufacturing method and use thereof. A multiple chemical crosslinking structure is constructed by blending a functional polyvinylsilicone grease with ultra-high molecular weight polyethylene (UHMWPE) and a ceramicized silicone rubber as a cable material matrix and using electron beam irradiation. In addition, organic/inorganic fillers in the matrix can form physical crosslinking points in the material. A physical-chemical dual crosslinking structure is constructed in the matrix, which can limit the motion and relaxation of molecular chains and improve the interaction between the insulation layer and sheath layer and refractory layers such as fillers and mica tapes to avoid the relative displacement during the laying and operation and improve the high-temperature resistance, creep resistance and stress relaxation resistance of a UHMWPE cable sheath material.

Abstract: The present disclosure provides anti-LILRB2 antibodies or antigen-binding fragments thereof, anti-LILRB2 chimeric antigen receptor protein, isolated polynucleotides encoding the same, pharmaceutical compositions comprising the same, and the uses thereof.

Abstract: A patch antenna unit and an antenna array in package are provided. The patch antenna unit includes: a substrate; and two groups of stacked patches which respectively stack on the substrate, geometric axes of the two groups of stacked patches being perpendicular to each other, wherein a radiating edge of each patch in the stacked patches is shaped as a function curve, the radiating edges of the patches in different layers are shaped as integrally orthogonal function curves, and a function curve corresponding to a shape of a non-radiating edge of each patch includes a ripple function curve.

Abstract: The present disclosure provides a communication chip, which is applied to a terminal device and includes a system control module, a radio frequency signal processing module, a first baseband processing module, and a second baseband processing module, where the system control module is respectively connected to the radio frequency signal processing module, the first baseband processing module and the second baseband processing module; the radio frequency signal processing module is further respectively connected to the first baseband processing module and the second baseband processing module.