Patents by Inventor Hongyuan Liu

Hongyuan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147607
    Abstract: A conductive film includes a substrate and a conductive layer. The conductive layer is disposed on the substrate and comprises a plurality of wires spaced apart and parallel to each other. At least one of the wires is provided with a stress dispersing structure. The stress dispersing structure is configured to disperse a stress generated when the conductive film is bent. A display panel comprises the conductive film.
    Type: Application
    Filed: April 15, 2022
    Publication date: May 2, 2024
    Applicant: TCL China Star Optoelectronics Technology Co., Ltd.
    Inventors: Xin LIU, Hongyuan XU, Juncheng XIAO
  • Publication number: 20240112008
    Abstract: In one embodiment, a method includes receiving, by a first client system, from one or more remote servers, a current version of a neural network model including multiple model parameters, training the neural network model on multiple examples retrieved from a local data store to generate multiple updated model parameters, wherein each of the examples includes one or more features and one or more labels, calculating a user valuation associated with the first client system, wherein the user valuation represents a measure of utility of training the neural network model on the multiple examples, and sending, to one or more of the remote servers, the trained neural network model and the user valuation, wherein the user valuation is associated with a likelihood of the first client system being selected for a subsequent training of the neural network model.
    Type: Application
    Filed: March 11, 2020
    Publication date: April 4, 2024
    Inventors: Kshitiz Malik, Seungwhan Moon, Honglei Liu, Anuj Kumar, Hongyuan Zhan, Ahmed Aly
  • Patent number: 11942872
    Abstract: The present application discloses a multi-path resonant circuit and a resonant converter. The multi-path resonant circuit includes at least two parallel N-phase resonant circuits, wherein N is an integer greater than or equal to 3. The at least two parallel N-phase resonant circuits include a first N-phase resonant circuit and a second N-phase resonant circuit. A first resonant inductor in any phase resonant circuit of the first N-phase resonant circuit is coupled with a second resonant inductor in any phase resonant circuit of the second N-phase resonant circuit. In this way, current sharing of the multi-path resonant circuit can be realized through a simpler structure.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: March 26, 2024
    Assignee: GUANGDONG SOFAR SMART SOLAR TECHNOLOGY CO., LTD.
    Inventors: Lei Chang, Xinwei Liu, Dongdong Yang, Hongyuan Jin
  • Patent number: 11917932
    Abstract: A soil conditioner spreader and an operation method thereof are provided. The soil conditioner spreader includes a spreader body, a ridger, a solid tank, two spiral drills, a rotary tillage wheel and a mulching device, where the spreader body is provided with a hopper in a front part. The hopper stores a conditioner. The solid tank is arranged above the spiral drills. The spreader body is connected to the solid tank through a feeding track. The ridger, the spiral rills, the rotary tillage wheel and the mulching device are successively arranged at the bottom of the spreader body from the rear to the front. The ridger ridges first, and then the spiral drills perform deep plowing, rotary tillage and scarification and apply the conditioner to a ridge. The rotary tillage wheel performs rotary tillage, and a nozzle sprays a nutrient solution or an herbicide/insecticide. Finally, the mulching device mulches.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: March 5, 2024
    Assignee: Institute of Agricultural Resources and Regional Planning, Chinese Academy of Agricultural Sciences
    Inventors: Jing Wang, Huancheng Pang, Yuyi Li, Li Zhang, Ping Cong, Na Liu, Hongyuan Zhang, Xiaoli Zhang
  • Patent number: 11911940
    Abstract: For in mold spraying, a double-inclined mixing nozzle is connected obliquely and fixedly with a side surface of a third half-mold through a lateral sealing structure and connected with a side surface of a first half-mold in an inclined and sealing manner, side faces of a first half-mold and the third half-mold are respectively provided with installation inclined surfaces. A lateral sealing structure includes a mounting plate and a sealing member. The sealing member is sleeved on the double-inclined mixing nozzle and is in transition fit with the double-inclined mixing nozzle and the mounting plate respectively. A butt sealing groove provided on the installation inclined surface of the first half-mold and is in sealing fit with the mounting plate.
    Type: Grant
    Filed: October 3, 2022
    Date of Patent: February 27, 2024
    Assignee: Tederic Machinery Co., Ltd.
    Inventors: Jianguo Zheng, Hongwei Zhou, Jiahui Lu, Haibo Shen, Wu Lin, Binqi Rao, Hongyuan Ma, Bo Liu, Guolin Liu, Jia Zhou
  • Publication number: 20240007591
    Abstract: Embodiments of the present disclosure provide a method and an apparatus of interaction video connection, an electronic device, and a storage medium. The method includes: receiving interaction match information pushed by a server, where the interaction match information includes first information of a second client, the first information of the second client is determined according to first data of a first client, the first data is used to indicate a match demand category corresponding to the first client; generating timing information, and displaying, according to the interaction match information, the timing information and the first information of the second client, where the timing information indicates a remaining duration before requesting an establishment of a video connection with the second client; and establishing, according to the timing information, the video connection with the second client.
    Type: Application
    Filed: September 15, 2023
    Publication date: January 4, 2024
    Inventors: Hongyuan LIU, Meilin LI, Di WU, You WANG, Wenchang QIU, Weiwang ZHANG, Yang LIU
  • Patent number: 11707017
    Abstract: A method for improving paddy fields by stirring and discharging slurry, including steps of rotary tillage scarifying, irrigation and paddy field soaking, slurry stirring, slurry layering, slurry discharging, airing, and water storing. The method for improving paddy fields by stirring and discharging slurry can quickly and greatly reduce soil salinity, with a cost lower than 1,000 yuan/hm2, a yield of 5,065 kg/hm2 to 6,304 kg/hm2; it saves the step of water harrowing before conventional rice planting and transplanting, and offers simple operation and promising prospect of replication and popularization, providing important support for increasing grain in soda saline-alkaline areas in the western Songnen Plain.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: July 25, 2023
    Assignee: NORTHEAST INSTITUTE OF GEOGRAPHY AND AGROECOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: Hongyuan Liu, Yanhong Zhou, Bolong Wen
  • Patent number: 11685862
    Abstract: Disclosed is a special soil conditioner for soda saline-alkaline paddy fields and a preparation method thereof, relating to the technical field of soil conditioner preparation. The raw materials of the soil conditioner include calcium chloride dihydrate, anionic polyacrylamide, mineral potassium fulvate, diethylaminoethyl (DA) polyamine, DA-7 or DA-8, brassinolide, potassium indolebutyrate, sodium ?-naphthylacetate and powder anti-caking agent. The above components are mixed according to a specific weight ratio to obtain the special soil conditioner for soda saline-alkaline paddy fields.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: June 27, 2023
    Assignee: Northeast Institute of Geography and Agroecology, Chinese Academy of Sciences
    Inventors: Hongyuan Liu, Bolong Wen, Guoshuang Chen
  • Patent number: 10684834
    Abstract: Embodiments of the present invention disclose a method and an apparatus for detecting inter-instruction data dependency. The method comprises: comparing a thread number corresponding to a historical access operation with a thread number corresponding to a write access operation, if the thread number corresponding to the write access operation is less than the thread number corresponding to the historical access operation, which indicates existence of data dependency for a to-be-detected instruction, terminating the detection; or comparing a thread number corresponding to a historical write access operation with a thread number corresponding to a read access operation, if the thread number corresponding to the read access operation is less than the thread number corresponding to the historical write access operation, which indicates existence of data dependency for the to-be-detected instruction, terminating the detection.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: June 16, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hongyuan Liu, Cho-Li Wang, KingTin Lam, Huanxin Lin, Bin Zhang, Junchao Ma
  • Patent number: 10510932
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: December 17, 2019
    Assignee: AMS SENSORS SINGAPORE PTE. LTD.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Publication number: 20190220257
    Abstract: Embodiments of the present invention disclose a method and an apparatus for detecting inter-instruction data dependency. The method comprises: comparing a thread number corresponding to a historical access operation with a thread number corresponding to a write access operation, if the thread number corresponding to the write access operation is less than the thread number corresponding to the historical access operation, which indicates existence of data dependency for a to-be-detected instruction, terminating the detection; or comparing a thread number corresponding to a historical write access operation with a thread number corresponding to a read access operation, if the thread number corresponding to the read access operation is less than the thread number corresponding to the historical write access operation, which indicates existence of data dependency for the to-be-detected instruction, terminating the detection.
    Type: Application
    Filed: March 21, 2019
    Publication date: July 18, 2019
    Inventors: Hongyuan LIU, Cho-LI WANG, KingTin LAM, Huanxin LIN, Bin ZHANG, Junchao MA
  • Publication number: 20190214533
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: February 14, 2019
    Publication date: July 11, 2019
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Patent number: 10243111
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 26, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Publication number: 20180006192
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: June 23, 2017
    Publication date: January 4, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee