Patents by Inventor Hongyuan Liu

Hongyuan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12382854
    Abstract: Provided are a straw returning method through thawing and wet puddling for saline-sodic paddy fields and an application thereof, relating to the technical field of returning straws to fields in saline-sodic paddy fields. According to the disclosure, regional characteristics are fully considered, “thawing” is taken as the core and combined with wet puddling.
    Type: Grant
    Filed: October 25, 2024
    Date of Patent: August 12, 2025
    Assignee: Northeast Institute of Geography and Agroecology, Chinese Academy of Sciences
    Inventors: Hongyuan Liu, Ren Geng, Ding Wang, Qingquan Xu, Yanhong Zhou, Xintong Liu
  • Patent number: 12324427
    Abstract: A weeding method of alternately cultivating ducks by block dividing in an organic rice field and an application thereof are provided. The method divides the organic rice field into blocks, and four blocks form an operation unit, and the ducklings are alternately cultivated simultaneously in each operation unit for the weeding.
    Type: Grant
    Filed: December 5, 2024
    Date of Patent: June 10, 2025
    Assignees: Northeast Institute of Geography and Agroecology, Chinese Academy of Sciences, Daan Xinda Agriculture Development Co. LTD
    Inventors: Hongyuan Liu, Bolong Wen, Qianshi Wang
  • Patent number: 12256659
    Abstract: A method for spring ploughing and land preparation in saline-sodic paddy fields with thawed water puddling and an application thereof are provided, relating to the technical field of spring ploughing and land preparation in saline-sodic paddy fields. The method includes the following steps: harvesting rice with low stubble left; removing straws from the paddy fields: removing straws after harvesting from fields; ploughing; fertilizing; irrigating for thawing; and drying.
    Type: Grant
    Filed: October 30, 2024
    Date of Patent: March 25, 2025
    Assignee: Northeast Institute of Geography and Agroecology, Chinese Academy of Sciences
    Inventors: Hongyuan Liu, Ding Wang, Qingquan Xu, Yanhong Zhou, Xintong Liu
  • Publication number: 20240007591
    Abstract: Embodiments of the present disclosure provide a method and an apparatus of interaction video connection, an electronic device, and a storage medium. The method includes: receiving interaction match information pushed by a server, where the interaction match information includes first information of a second client, the first information of the second client is determined according to first data of a first client, the first data is used to indicate a match demand category corresponding to the first client; generating timing information, and displaying, according to the interaction match information, the timing information and the first information of the second client, where the timing information indicates a remaining duration before requesting an establishment of a video connection with the second client; and establishing, according to the timing information, the video connection with the second client.
    Type: Application
    Filed: September 15, 2023
    Publication date: January 4, 2024
    Inventors: Hongyuan LIU, Meilin LI, Di WU, You WANG, Wenchang QIU, Weiwang ZHANG, Yang LIU
  • Patent number: 11707017
    Abstract: A method for improving paddy fields by stirring and discharging slurry, including steps of rotary tillage scarifying, irrigation and paddy field soaking, slurry stirring, slurry layering, slurry discharging, airing, and water storing. The method for improving paddy fields by stirring and discharging slurry can quickly and greatly reduce soil salinity, with a cost lower than 1,000 yuan/hm2, a yield of 5,065 kg/hm2 to 6,304 kg/hm2; it saves the step of water harrowing before conventional rice planting and transplanting, and offers simple operation and promising prospect of replication and popularization, providing important support for increasing grain in soda saline-alkaline areas in the western Songnen Plain.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: July 25, 2023
    Assignee: NORTHEAST INSTITUTE OF GEOGRAPHY AND AGROECOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: Hongyuan Liu, Yanhong Zhou, Bolong Wen
  • Patent number: 11685862
    Abstract: Disclosed is a special soil conditioner for soda saline-alkaline paddy fields and a preparation method thereof, relating to the technical field of soil conditioner preparation. The raw materials of the soil conditioner include calcium chloride dihydrate, anionic polyacrylamide, mineral potassium fulvate, diethylaminoethyl (DA) polyamine, DA-7 or DA-8, brassinolide, potassium indolebutyrate, sodium ?-naphthylacetate and powder anti-caking agent. The above components are mixed according to a specific weight ratio to obtain the special soil conditioner for soda saline-alkaline paddy fields.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: June 27, 2023
    Assignee: Northeast Institute of Geography and Agroecology, Chinese Academy of Sciences
    Inventors: Hongyuan Liu, Bolong Wen, Guoshuang Chen
  • Patent number: 10684834
    Abstract: Embodiments of the present invention disclose a method and an apparatus for detecting inter-instruction data dependency. The method comprises: comparing a thread number corresponding to a historical access operation with a thread number corresponding to a write access operation, if the thread number corresponding to the write access operation is less than the thread number corresponding to the historical access operation, which indicates existence of data dependency for a to-be-detected instruction, terminating the detection; or comparing a thread number corresponding to a historical write access operation with a thread number corresponding to a read access operation, if the thread number corresponding to the read access operation is less than the thread number corresponding to the historical write access operation, which indicates existence of data dependency for the to-be-detected instruction, terminating the detection.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: June 16, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hongyuan Liu, Cho-Li Wang, KingTin Lam, Huanxin Lin, Bin Zhang, Junchao Ma
  • Patent number: 10510932
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: December 17, 2019
    Assignee: AMS SENSORS SINGAPORE PTE. LTD.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Publication number: 20190220257
    Abstract: Embodiments of the present invention disclose a method and an apparatus for detecting inter-instruction data dependency. The method comprises: comparing a thread number corresponding to a historical access operation with a thread number corresponding to a write access operation, if the thread number corresponding to the write access operation is less than the thread number corresponding to the historical access operation, which indicates existence of data dependency for a to-be-detected instruction, terminating the detection; or comparing a thread number corresponding to a historical write access operation with a thread number corresponding to a read access operation, if the thread number corresponding to the read access operation is less than the thread number corresponding to the historical write access operation, which indicates existence of data dependency for the to-be-detected instruction, terminating the detection.
    Type: Application
    Filed: March 21, 2019
    Publication date: July 18, 2019
    Inventors: Hongyuan LIU, Cho-LI WANG, KingTin LAM, Huanxin LIN, Bin ZHANG, Junchao MA
  • Publication number: 20190214533
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: February 14, 2019
    Publication date: July 11, 2019
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Patent number: 10243111
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 26, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Publication number: 20180006192
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: June 23, 2017
    Publication date: January 4, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee