Patents by Inventor Hongyuan XIE

Hongyuan XIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10362292
    Abstract: A system for three dimensional imaging includes: a light source; a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal; an optical circuitry connected to the light source; a light sensor circuitry connected with the optical circuitry and configured to sense optical output of the optical circuitry and convert the optical output into a plurality of electrical signals; and a signal processing circuit connected with the light sensor circuitry and configured to extract 3D information of the object from the electrical signals. A mobile phone having the system and a method for three dimensional imaging are also provided.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: July 23, 2019
    Assignee: SHENZHEN DANSHA TECHNOLOGY CO., LTD.
    Inventor: Hongyuan Xie
  • Publication number: 20180167603
    Abstract: A system for three dimensional imaging includes: a light source; a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal; an optical circuitry connected to the light source; a light sensor circuitry connected with the optical circuitry and configured to sense optical output of the optical circuitry and convert the optical output into a plurality of electrical signals; and a signal processing circuit connected with the light sensor circuitry and configured to extract 3D information of the object from the electrical signals. A mobile phone having the system and a method for three dimensional imaging are also provided.
    Type: Application
    Filed: January 24, 2018
    Publication date: June 14, 2018
    Inventor: Hongyuan Xie
  • Patent number: 9967542
    Abstract: A 3D imaging system includes: a light source; a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal; an optical module connected to the light source; a light sensing device connected with the optical module and configured to sense optical output of the optical module and convert the optical output into a plurality of electrical signals; and a signal processing module connected with the light sensing device and configured to extract 3D information of the object from the electrical signals.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: May 8, 2018
    Assignee: Shenzhen Dansha Technology Co., Ltd.
    Inventor: Hongyuan Xie
  • Publication number: 20170302906
    Abstract: A 3D imaging system includes: a light source; a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal; an optical module connected to the light source; a light sensing device connected with the optical module and configured to sense optical output of the optical module and convert the optical output into a plurality of electrical signals; and a signal processing module connected with the light sensing device and configured to extract 3D information of the object from the electrical signals.
    Type: Application
    Filed: April 19, 2016
    Publication date: October 19, 2017
    Inventor: Hongyuan XIE