Patents by Inventor Honmo SHI

Honmo SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDERING STRUCTURE BETWEEN CIRCUIT BOARDS
    Publication number: 20080251280
    Abstract: A substrate coupling structure including a flexible circuit board having first conductors provided thereon, a rigid circuit board having second conductors provided thereon so as to face the first conductors, solder plating disposed on at least one of the first conductors and the second conductors, and an insulating layer which has a thickness larger than the sum of thicknesses of the first and second conductors while having a thickness smaller than the sum of the thicknesses of the first and second conductors plus a thickness of the solder plating.
    Type: Application
    Filed: September 5, 2007
    Publication date: October 16, 2008
    Applicant: Fujikura Ltd.
    Inventors: Honmo SHI, Hiroki Maruo