Patents by Inventor Hooi Bin Lim

Hooi Bin Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including semiconductor dies of differing sizes and capacities
    Patent number: 11552050
    Abstract: A semiconductor device includes a stack of semiconductor dies, stacked in a stepped offset configuration, where the dies have different storage capacities and different sizes. Using dies of different sizes allows dies to be added to the stack without adding to the footprint of the semiconductor device. Using dies of different storage capacity also allows semiconductor devices to be tailored to specific storage capacity needs.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: January 10, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Ahmad Zarif Bin Azahar, Nur Syazwani Binti Mohd Najman, Muhammad Syafiq Bin Mazlan, Rolando Reyes, Jr., Hooi Bin Lim
  • SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR DIES OF DIFFERING SIZES AND CAPACITIES
    Publication number: 20220230992
    Abstract: A semiconductor device includes a stack of semiconductor dies, stacked in a stepped offset configuration, where the dies have different storage capacities and different sizes. Using dies of different sizes allows dies to be added to the stack without adding to the footprint of the semiconductor device. Using dies of different storage capacity also allows semiconductor devices to be tailored to specific storage capacity needs.
    Type: Application
    Filed: February 12, 2021
    Publication date: July 21, 2022
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Ahmad Zarif Bin Azahar, Nur Syazwani Binti Mohd Najman, Muhammad Syafiq Bin Mazlan, Rolando Reyes, JR., Hooi Bin Lim
  • Electroluminescent device with a blocking layer and a dummy electrode region
    Patent number: 7473924
    Abstract: Disclosed is an organic electroluminescent display, comprising a first active electrode region and a first dummy electrode region, the first dummy electrode region electrically isolated from the first active electrode region. Further disclosed is an organic electroluminescent display, comprising a first active electrode region, a first dummy electrode region, and a blocking layer extending on said dummy electrode region preventing light emission.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: January 6, 2009
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Ian Millard, Hooi Bin Lim
  • Encapsulation for electroluminescent devices
    Patent number: 7423375
    Abstract: An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: September 9, 2008
    Assignee: OSRAM GmbH
    Inventors: Ewald Guenther, Hooi Bin Lim, Shi Chai Chong, David Lacey
  • Encapsulation for organic devices
    Patent number: 7193364
    Abstract: A method of encapsulating devices including providing a getter layer in the penetration path of atmospheric elements. The getter layer serves as a barrier to potentially deleterious atmospheric components, such as moisture and gases, that penetrate the device. In one embodiment, the getter layer surrounds an active region where active component or components are formed.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: March 20, 2007
    Assignee: Osram Opto Semiconductors (Malaysia) Sdn. Bhd
    Inventors: Hagen Klausmann, Yuen Sin Lew, Hou Siong Tan, Hooi Bin Lim
  • Uniform deposition of organic layer
    Patent number: 7148624
    Abstract: A method to ensure uniform deposition of organic layer is disclosed. Since the organic layer is very thin, any deviation from the target thickness will result in visible optical defects. A homogenous layer which exhibits good coating behaviour with organic materials is provided beneath the organic layer. By covering the metal interconnects, the adverse effect on the uniformity of the polymer layer is reduced or prevented.
    Type: Grant
    Filed: April 17, 2003
    Date of Patent: December 12, 2006
    Assignee: Osram Opto Semiconductors (Malaysia) Sdn. Bhd
    Inventors: Ewald Guenther, Hooi Bin Lim, Cheng Kooi Tan, Shi Chai Chong, Hagen Klausmann
  • Electrode patterning in OLED devices
    Patent number: 7049630
    Abstract: An OLED device having pillars with a cross section that is wider on the top. The pillars structure a conductive layer during deposition into distinct portions located between the pillars and on the top of the pillars. In one embodiment, the grooves between the pillars extend outside the electrode region to prevent shorting of adjacent electrodes.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: May 23, 2006
    Assignee: Osram Opto Semiconductors (Malaysia) Sdn. Bhd
    Inventors: Hooi Bin Lim, Hagen Klausmann, Bernd Fritz
  • Interconnection for organic devices
    Patent number: 7026660
    Abstract: A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: April 11, 2006
    Assignee: Osram Opto Semiconductors (Malaysia) Sdn. Bhd
    Inventors: Ewald Guenther, Hooi Bin Lim, Shahrol Izzanni Abdul Manaf, Stefan Eigenbrodt, Soong Lin Teng
  • Robust electrode patterning in OLED devices
    Patent number: 6930321
    Abstract: An OLED device having a conductive layer patterned by pillars to form electrodes in the device is disclosed, wherein portions of the pillars have at least 2 sub-rows to prevent shorting of adjacent electrodes. In one embodiment, the ends of the pillars are split into at least 2 sub-rows.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: August 16, 2005
    Assignee: Osram Opto Semiconductors (Malaysia) Sdn. Bhd
    Inventors: Ewald Guenther, Hooi Bin Lim, Ed Vin Soh, Hou Siong Tan, Hagen Klausmann
  • Robust Electrode Patterning in OLED Devices
    Publication number: 20040227139
    Abstract: An OLED device having a conductive layer patterned by pillars to form electrodes in the device is disclosed, wherein portions of the pillars have at least 2 sub-rows to prevent shorting of adjacent electrodes. In one embodiment, the ends of the pillars are split into at least 2 sub-rows.
    Type: Application
    Filed: January 15, 2004
    Publication date: November 18, 2004
    Inventors: Ewald Guenther, Hooi Bin Lim, Ed Vin Soh, Hou Siong Tan, Hagen Klausmann
  • INTERCONNECTION FOR ORGANIC DEVICES
    Publication number: 20040211966
    Abstract: A device having bond pads within a bond pad region, the bond pads comprising a conductive material that is stable when exposed to atmospheric constituents. The bond pads can be formed from conductive oxide materials such as indium tin oxide. A contact layer is provided to enhance the conductivity between the bond pads and the active component of the device.
    Type: Application
    Filed: April 25, 2003
    Publication date: October 28, 2004
    Inventors: Ewald Guenther, Hooi Bin Lim, Shahrol Izzanni Abdul Manaf, Stefan Eigenbrodt, Soong Lin Teng
  • Electrode patterning in OLED devices
    Patent number: 6784009
    Abstract: An OLED device having pillars with cross section that is wider on the top. The pillars structure a conductive layer during deposition into distinct portions located between the pillars and on the top of the pillars. In one embodiment, the grooves between the pillars extend outside the electrode region to prevent shorting of adjacent electrodes.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: August 31, 2004
    Assignee: Osram Opto Semiconductors (Malaysia) SDN BHD
    Inventors: Hooi Bin Lim, Hagen Klausmann, Bernd Fritz
  • Electrode Patterning in OLED Devices
    Publication number: 20040104385
    Abstract: An OLED device having pillars with a cross section that is wider on the top. The pillars structure a conductive layer during deposition into distinct portions located between the pillars and on the top of the pillars. In one embodiment, the grooves between the pillars extend outside the electrode region to prevent shorting of adjacent electrodes.
    Type: Application
    Filed: November 24, 2003
    Publication date: June 3, 2004
    Inventors: Hooi Bin Lim, Hagen Klausmann, Bernd Fritz
  • Encapsulation for organic devices
    Publication number: 20040051449
    Abstract: A method of encapsulating devices including providing a getter layer in the penetration path of atmospheric elements. The getter layer serves as a barrier to potentially deleterious atmospheric components, such as moisture and gases, that penetrate the device. In one embodiment, the getter layer surrounds an active region where active component or components are formed.
    Type: Application
    Filed: September 12, 2002
    Publication date: March 18, 2004
    Applicant: Osram Opto Semiconductors (Malaysia) Sdn. Bhd.
    Inventors: Hagen Klausmann, Yuen Sin Lew, Hou Siong Tan, Hooi Bin Lim
  • Robust electrode patterning in OLED devices
    Patent number: 6696312
    Abstract: A method of fabricating OLED devices is disclosed. A conductive layer is patterned by pillars to form electrodes in the device, wherein portions of the pillars have at least 2 sub-rows to prevent shorting of adjacent electrodes. In one embodiment, the ends of the pillars are split into at least 2 sub-rows.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: February 24, 2004
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Ewald Guenther, Hooi Bin Lim, Ed Vin Soh, Hou Siong Tan, Hagen Klausmann
  • UNIFORM DEPOSITION OF ORGANIC LAYER
    Publication number: 20030214232
    Abstract: A method to ensure uniform deposition of organic layer is disclosed. Since the organic layer is very thin, any deviation from the target thickness will result in visible optical defects. A homogenous layer which exhibits good coating behaviour with organic materials is provided beneath the organic layer. By covering the metal interconnects, the adverse effect on the uniformity of the polymer layer is reduced or prevented.
    Type: Application
    Filed: April 17, 2003
    Publication date: November 20, 2003
    Inventors: Ewald Guenther, Hooi Bin Lim, Cheng Kooi Tan, Shi Chai Chong, Hagen Klausmann
  • Encapsulation for electroluminescent devices
    Publication number: 20030209979
    Abstract: An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.
    Type: Application
    Filed: May 7, 2002
    Publication date: November 13, 2003
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Ewald Guenther, Hooi Bin Lim, Shi Chai Chong, David Lacey
  • Robust electrode patterning in OLED devices
    Publication number: 20030170929
    Abstract: A method of fabricating OLED devices is disclosed. A conductive layer is patterned by pillars to form electrodes in the device, wherein portions of the pillars have at least 2 sub-rows to prevent shorting of adjacent electrodes. In one embodiment, the ends of the pillars are split into at least 2 sub-rows.
    Type: Application
    Filed: September 6, 2002
    Publication date: September 11, 2003
    Inventors: Ewald Guenther, Hooi Bin Lim, Ed Vin Soh, Hou Siong Tan, Hagen Klausmann
  • Electrode patterning in OLED devices
    Publication number: 20030096446
    Abstract: An OLED device having pillars with cross section that is wider on the top. The pillars structure a conductive layer during deposition into distinct portions located between the pillars and on the top of the pillars. In one embodiment, the grooves between the pillars extend outside the electrode region to prevent shorting of adjacent electrodes.
    Type: Application
    Filed: September 6, 2002
    Publication date: May 22, 2003
    Inventors: Hooi Bin Lim, Hagen Klausmann, Bernd Fritz