Abstract: A planar conductive millimeter-wave lens includes: a planar conductive plate with a first surface and a second surface, wherein the first surface is parallel to the second surface; a plurality of openings from the first surface through the planar conductive plate to the second surface, where an axis of each opening is perpendicular to the first surface and the second surface. A size of each opening is a function of a position of said each opening on the planar conductive plate such that an insertion phase collectively imposed by the openings on an incident wave causes the incident wave to pass through the first surface and the planar conductive plate, exit from the second surface and to focus at a predetermined distance from the second surface.

Abstract: A dielectric encapsulated metal lens includes a planar conductive plate with a first surface and a second surface, wherein the first surface is parallel to the second surface; a plurality of openings from the first surface through the planar conductive plate to the second surface, wherein a longitudinal axis of each opening is perpendicular to the first surface and the second surface, wherein a size of each opening is a function of a position of said each opening on the planar conductive plate; and a dielectric material encapsulating the planar conductive plate and filing the plurality of openings, where the dielectric material forms a top surface and a bottom surface for the metal lens to reduce reflected energy.

Abstract: A planar conductive millimeter-wave lens includes: a planar conductive plate with a first surface and a second surface, wherein the first surface is parallel to the second surface; a plurality of openings from the first surface through the planar conductive plate to the second surface, where an axis of each opening is perpendicular to the first surface and the second surface. A size of each opening is a function of a position of said each opening on the planar conductive plate such that an insertion phase collectively imposed by the openings on an incident wave causes the incident wave to pass through the first surface and the planar conductive plate, exit from the second surface and to focus at a predetermined distance from the second surface.

Abstract: An apparatus includes at least one transmitter configured to transmit wireless signals that create different localized heating in different portions of a scene. The different localized heating in the different portions of the scene is based on different moisture or liquid content within objects in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the different localized heating in the different portions of the scene and to create a desired thermal radiation pattern in the scene. The desired thermal radiation pattern in the scene may include a camouflage pattern that increases clutter in an infrared image, at least one temporary infrared marker, or at least one false shape in an infrared image. The desired thermal radiation pattern could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.

Abstract: In one aspect, a method includes receiving signals directly or indirectly from a transmitter. The received signals include a target signal, a clutter signal and a reference signal. The method also includes filtering the clutter signal from the received signals, processing the filtered radar data to obtain range and Doppler data, detecting and tracking a target from the range and Doppler data and classifying the target.

Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.

Abstract: An apparatus includes at least one transmitter configured to transmit wireless signals that create different localized heating in different portions of a scene. The different localized heating in the different portions of the scene is based on different moisture or liquid content within objects in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the different localized heating in the different portions of the scene and to create a desired thermal radiation pattern in the scene. The desired thermal radiation pattern in the scene may include a camouflage pattern that increases clutter in an infrared image, at least one temporary infrared marker, or at least one false shape in an infrared image. The desired thermal radiation pattern could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.

Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is enclosed in a space defined by the respective aperture and the second substrate. The module includes a lid and at least one mode suppression circuit disposed in the lid. The modules may include an invariant die where different technologies are stacked together.

Abstract: An apparatus includes at least one transmitter configured to transmit wireless signals that heat objects in a scene and cause the objects to radiate thermal energy and create a pattern of thermal radiation in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the creation of the pattern of thermal radiation in the scene. The pattern of thermal radiation in the scene could include a camouflage pattern that increases clutter in an infrared image of the scene, at least one temporary infrared marker, or at least one false shape in an infrared image of the scene. The pattern of thermal radiation in the scene could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.

Abstract: Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing.

Abstract: A reconstituted wafer includes a plurality of apertures defined in a first substrate. A module is positioned in each aperture and coupled to circuit traces on the first substrate by operation of beam leads extending from the module. A second substrate is positioned over the first substrate and each module is hermetically sealed in a space defined by the respective aperture and the second substrate. One or more vias are provided to access I/O signals at a surface of the first or second substrates. The modules may include an invariant die where different technologies are stacked together.

Abstract: An apparatus includes at least one transmitter configured to transmit wireless signals that heat objects in a scene and cause the objects to radiate thermal energy and create a pattern of thermal radiation in the scene. The apparatus also includes at least one controller configured to control the at least one transmitter in order to control the creation of the pattern of thermal radiation in the scene. The pattern of thermal radiation in the scene could include a camouflage pattern that increases clutter in an infrared image of the scene, at least one temporary infrared marker, or at least one false shape in an infrared image of the scene. The pattern of thermal radiation in the scene could reduce a contrast between a cold infrared background in the scene and one or more targets in the scene.

Abstract: An electronic circuit comprising: an integrated circuit chip, the integrated circuit chip having a top face; portions of the top face of the chip being covered by a first metal layer electrically connected to the integrated circuit; and a dialectic layer formed on the top face of the chip beside and on top of said first metal layer; wherein the dielectric layer extends parallel to the top face of the chip beyond the edges of the chip, the first metal layer extending in the dielectric layer beyond the edges of the chip; and wherein portions of a top surface of the dielectric layer are covered by a second metal layer, portions of the first and second metal layers being electrically connected through the dielectric layer.

Abstract: Devices and methods for manufacturing RF circuits and systems in both passive and active forms are contemplated herein. Exemplary devices include 3D electrical and mechanical structures which are created from individual slices which may be assembled to create a final functional block such as a circuit, component or a system. The slices may fabricated by a variety of manufacturing techniques, such as micromachined layer-by-layer metal batch processing.

Abstract: A flexible, printable antenna for automotive radar. The antenna can be printed onto a thin, flexible substrate, and thus can be bent to conform to a vehicle body surface with compound curvature. The antenna can be mounted to the interior of a body surface such as a bumper fascia, where it cannot be seen but can transmit radar signals afield. The antenna can also be mounted to and blended into the exterior of an inconspicuous body surface, or can be made transparent and mounted to the interior or exterior of a glass surface. The antenna includes an artificial impedance surface which is tailored based on the three-dimensional shape of the surface to which the antenna is mounted and the desired radar wave pattern. The antenna can be used for automotive collision avoidance applications using 22-29 GHz or 76-81 GHz radar, and has a large aperture to support high angular resolution of radar data.

Abstract: An electronic circuit comprising: an integrated circuit chip, the integrated circuit chip having a top face; portions of the top face of the chip being covered by a first metal layer electrically connected to the integrated circuit; and a dielectic layer formed on the top face of the chip beside and on top of said first metal layer; wherein the dielectric layer extends parallel to the top face of the chip beyond the edges of the chip, the first metal layer extending in the dielectric layer beyond the edges of the chip; and wherein portions of a top surface of the dielectric layer are covered by a second metal layer, portions of the first and second metal layers being electrically connected through the dielectric layer.

Abstract: Heat spreading device using microfabricated microfluidic structures to cool microelectronic devices.

Abstract: A flexible, printable antenna for automotive radar. The antenna can be printed onto a thin, flexible substrate, and thus can be bent to conform to a vehicle body surface with compound curvature. The antenna can be mounted to the interior of a body surface such as a bumper fascia, where it cannot be seen but can transmit radar signals afield. The antenna can also be mounted to and blended into the exterior of an inconspicuous body surface, or can be made transparent and mounted to the interior or exterior of a glass surface. The antenna includes an artificial impedance surface which is tailored based on the three-dimensional shape of the surface to which the antenna is mounted and the desired radar wave pattern. The antenna can be used for automotive collision avoidance applications using 22-29 GHz or 76-81 GHz radar, and has a large aperture to support high angular resolution of radar data.

Abstract: The interface resistance between the source/drain and gate of an HFET may be significantly reduced by engineering the bandgap of the 2DEG outside a gate region such that the charge density is substantially increased. The resistance may be further reduced by using an n+GaN Cap layer over the channel layer and barrier layer such that a horizontal surface of the barrier layer beyond the gate region is covered by the n+GaN Cap layer. This technique is applicable to depletion and enhancement mode HFETs.

Abstract: Described is a pattern matching system for matching a test image with a 3D template. The system is initiated by generating a library of templates (each individual template is a three-dimensional array, with each pixel in the array representing a value at a particular x, y, and z coordinate). Each column of pixels along one axis (e.g., z) is converted into a neural input. Each neural input is fed through a neural network to establish a delayed connection between each neural input and output neuron and to generate a template neural network. Separately, a test image is converted into neural inputs. The neural inputs of the test image are input the template neural network to generate output neurons. The output neurons are evaluated to identify a location of the template in the test image.