Abstract: Disclosed are a memory device based on an IGO channel layer and a method of fabricating the same. More particularly, the memory device according to an embodiment includes multilayers including at least one transition metal; and a channel layer formed adjacent to the multilayers and configured to include an indium gallium oxide (IGO) material.

Abstract: Disclosed are a memory device based on an IGO channel layer and a method of fabricating the same. More particularly, the memory device according to an embodiment includes multilayers including at least one transition metal; and a channel layer formed adjacent to the multilayers and configured to include an indium gallium oxide (IGO) material.

Abstract: The present invention relates to a method of forming and transferring a thin film. The method of forming and transferring a thin film according to one embodiment may include a step of bonding a carrier wafer coated with a polymer bonding material to the top of a silicon-on-insulator (SOI) wafer formed by sequentially laminating a backside silicon layer, a buried oxide layer, and a silicon layer; a step of etching the backside silicon layer using the buried oxide layer as an etching barrier, and then selectively etching the buried oxide layer; a step of separating the carrier wafer from the polymer bonding material, and bonding a target wafer including an oxide layer to the bottom of the silicon layer through direct bonding; and a step of transferring the silicon layer to the top of the target wafer including the oxide layer by removing the polymer bonding material.

Abstract: The present invention relates to a method of forming and transferring a thin film. The method of forming and transferring a thin film according to one embodiment may include a step of bonding a carrier wafer coated with a polymer bonding material to the top of a silicon-on-insulator (SOI) wafer formed by sequentially laminating a backside silicon layer, a buried oxide layer, and a silicon layer; a step of etching the backside silicon layer using the buried oxide layer as an etching barrier, and then selectively etching the buried oxide layer; a step of separating the carrier wafer from the polymer bonding material, and bonding a target wafer including an oxide layer to the bottom of the silicon layer through direct bonding; and a step of transferring the silicon layer to the top of the target wafer including the oxide layer by removing the polymer bonding material.

Abstract: A spindle motor includes a stator, and a rotor forming a bearing clearance with the stator. The rotor is provided with an insertion groove formed therein into which a portion of the stator is inserted, and first and second sealing parts having liquid-vapor interfaces formed therein, respectively, are formed inside and outside the insertion groove, respectively. The first and second sealing parts are in communication with each other via a connection hole.

Abstract: There is provided a spindle motor including: a shaft having a lower end portion fixed to a lower thrust member and having a flange part disposed at an upper end portion thereof; a rotating member rotating around the shaft and including a sleeve part disposed between the lower thrust member and the flange part; a sealing member fixed to an outer peripheral surface of the flange part of the shaft; a cap member fixed to the rotating member to be disposed to face the sealing member; and a cover member having a region surrounding amounting hole seated on an upper surface of the flange part of the shaft and forming a labyrinth seal together with the cap member.

Abstract: There is provided a spindle motor including: a rotating body including a sleeve part disposed between a thrust member and a flange part of a shaft, a connection part extended from the sleeve part, and a rotor hub part extended from the connection part, 0.5 mm<min{L1, L2}<{(H?0.3)?(h1+h2+h3)}/cos ? is satisfied.

Abstract: There are provided a spindle motor and a hard disk drive including the same, the spindle motor including: a thrust member fixed to a base member; a shaft fixed to the thrust member; a sleeve disposed above the thrust member, rotatably installed with respect to the shaft, and including a catching portion protruding outwardly from a lower portion thereof in a radial direction; a rotor hub coupled to the sleeve and rotating together therewith; and a stopper disposed above the catching portion and fixed to the base member.