Abstract: A printed circuit board assembly includes a main printed circuit board including a first main signal line and a first dielectric having a first permittivity; a sub printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board.

Abstract: Disclosed is a printed circuit board comprising: an integrated circuit (IC) mounted on a board plane; a power supply provided on the board plane and connected to an external power source to supply necessary power to the IC; a power plane provided in the board plane and configured to provide a main path for supplying the power from the power supply to the IC; a ground plane provided in the board plane and configured to provide a ground path corresponding to the power plane; a body mounted on the board plane by surface mount technology (SMT) and formed of an insulating material; and a conductive member disposed on the body and having one end connected to the power supply and another end connected to the IC to provide an additional power supply path in parallel with the power plane.

Abstract: A printed circuit board assembly includes a main printed circuit board including a first main signal line and a first dielectric having a first permittivity; a sub printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board.

Abstract: Disclosed is a printed circuit board comprising: an integrated circuit (IC) mounted on a board plane; a power supply provided on the board plane and connected to an external power source to supply necessary power to the IC; a power plane provided in the board plane and configured to provide a main path for supplying the power from the power supply to the IC; a ground plane provided in the board plane and configured to provide a ground path corresponding to the power plane; a body mounted on the board plane by surface mount technology (SMT) and formed of an insulating material; and a conductive member disposed on the body and having one end connected to the power supply and another end connected to the IC to provide an additional power supply path in parallel with the power plane.

Abstract: A connector having an improved shield performance and EMI shield structure are provided. The connector includes a conductive terminal, a fixed body configured to accommodate the conductive terminal therein, and a shield housing having an open lower portion through which a lower end portion of the conductive terminal is connected to a printed circuit board and formed in a body to accommodate the conductive terminal and the fixed body.

Abstract: A connector having an improved shield performance and EMI shield structure are provided. The connector includes a conductive terminal, a fixed body configured to accommodate the conductive terminal therein, and a shield housing having an open lower portion through which a lower end portion of the conductive terminal is connected to a printed circuit board and formed in a body to accommodate the conductive terminal and the fixed body.