Abstract: A method of manufacturing a semiconductor device includes forming a plurality of overlay molds on a semiconductor structure by developing a photoresist material layer of the semiconductor structure, the semiconductor structure including a first layer having a plurality of overlay marks, the plurality of overlay molds at least partially overlapping at least some of the plurality of overlay marks; and measuring one or more overlays by radiating a light having a wavelength band onto the semiconductor structure, each of the one or more overlays indicating an amount of consistency of the first layer and a second layer of the semiconductor structure, the wavelength band being set based on the plurality of overlay marks and the plurality of overlay molds, the second layer being between the first layer and the photoresist material layer.

Abstract: A substrate inspection apparatus includes a light irradiating unit irradiating first light to an inspection target on a stage, a light detecting unit detecting second light reflected by the inspection target, a spectrum generator generating a first spectrum from the second light, a noise filter module removing a noise signal from the first spectrum to generate a second spectrum, a spectrum analyzer determining a first calibration parameter and a first calibration value thereof from the second spectrum, and a hardware controller adjusting at least one of the stage, the light irradiating unit and the light detecting unit using the first calibration parameter and the first calibration value.

Abstract: A semiconductor pattern detecting apparatus is provided.

Abstract: The present invention relates to a vibrating toothbrush, and more particularly to a vibrating toothbrush enabled to perform toothbrushing for a running time, periodically output an alarm signal in a multisensory way to guide change of a region subject to toothbrushing, and supply driving power in the form of pulses according to a period, thereby reducing power consumption and rapid driving stress of a motor.

Abstract: A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.

Abstract: An apparatus for inspecting a display panel for defects includes a table which supports the display panel, a laser excitation unit that irradiates a non-display area of the display panel with a point laser beam, a thermal wave detecting unit that generates thermal wave images of irradiated portions of the non-display area, a driving unit, and a control unit. A groove corresponding to an edge of the display panel may be defined in a top surface of the table. A defect, such as a crack, may be detected by comparing a defect pattern obtained from the thermal wave images with a pre-registered defect pattern.

Abstract: In a method of inspecting a structure, a first ultrasonic signal generated from a target structure by a first laser beam is received. The first ultrasonic signal is generated by providing the first laser beam generated from a first excitation unit to the target structure. A second ultrasonic signal generated from the target structure by a second laser beam different from the first laser beam is received. The second ultrasonic signal is generated by providing the second laser beam generated from a second excitation unit to the target structure. A third ultrasonic signal generated from the target structure by the first and second laser beams is received. The third ultrasonic signal is generated by simultaneously providing the first and second laser beams to the target structure. It is determined whether the target structure is damaged based on first, second and third ultrasonic frequency spectra that are obtained by converting the first, second and third ultrasonic signals, respectively.

Abstract: An optical measuring method includes generating a Bessel beam, filtering the Bessel beam to generate a focused Bessel beam, vertically irradiating the focused Bessel beam onto a substrate in which an opening is formed, and detecting light reflected from the substrate to obtain an image of a bottom surface of the opening.

Abstract: Disclosed are a system and a method for precisely measuring a structure are disclosed. A reference meter installed at a fixed location provides GPS reference information. A plurality of response meters, respectively installed at a plurality of positions of the structure, acquire acceleration information through acceleration sensors and measure a plurality of real-time kinematic (RTK) displacement data based on the GPS reference information, respectively. The response meters synchronize acceleration information with the plurality of RTK displacement data measured to generate into a packet to be transmitted. An operation processor receives the acceleration information and the plurality of RTK displacement data and calculates structure response information. With the GPS and accelerometers, the dynamic behaviors of structures including high-rise buildings, bridges, dams, and harbors can be precisely measured.

Abstract: Disclosed are a system and a method for precisely measuring a structure are disclosed. A reference meter installed at a fixed location provides GPS reference information. A plurality of response meters, respectively installed at a plurality of positions of the structure, acquire acceleration information through acceleration sensors and measure a plurality of real-time kinematic (RTK) displacement data based on the GPS reference information, respectively. The response meters synchronize acceleration information with the plurality of RTK displacement data measured to generate into a packet to be transmitted. An operation processor receives the acceleration information and the plurality of RTK displacement data and calculates structure response information. With the GPS and accelerometers, the dynamic behaviors of structures including high-rise buildings, bridges, dams, and harbors can be precisely measured.

Abstract: The present invention relates to: a novel Pichia kudriavzevii microorganism NG7 showing heat resistance and acid resistance; a composition, for producing organic acid or alcohol, which comprises the microorganism and a culture of the same; and a method, for producing an organic acid or alcohol, which comprises culturing the microorganism.

Abstract: There are provided a message communication device and method. A message communication device according to an exemplary embodiment includes a header modifying unit configured to modify a message header by adding additional information used together with an identity when a public key corresponding to the identity of a recipient is generated to be the message header, and a message transmitting unit configured to transmit a message including data encrypted based on the public key and the modified message header.

Abstract: A sonic vibration toothbrush includes a head extending in an axial direction with a plurality of bristles implanted at an outer circumference thereof in a direction perpendicular to the axial direction; a head arm having an inner space to transmit a sonic wave to the head. A top portion of the head arm where the inner space is narrowed is coupled to the head and a motor accommodating portion that accommodates a motor therein and transmits a sonic wave generated by a rotating force of the motor to the head arm. The toothbrush further includes a handle having a space for accommodating a battery; an input unit provided at the motor accommodating portion in a button form; a display unit provided at the handle; and a control circuit that controls the motor according to input information provided from the input unit.

Abstract: An apparatus for X-ray inspection is provided. The apparatus includes: a stage on which an inspection target is loaded, the stage including a first surface and an opposite second surface; an X-ray generator disposed on or over the first surface of the inspection target and configured to irradiate the inspection target with incident X-rays; and a detection system disposed on or under the second surface of the inspection target and configured to detect first transmitted X-rays transmitted through the inspection target. The detection unit includes a first lens system and a second lens system. The first transmitted X-rays pass through one of the first lens system and the second lens system. The second lens system includes a micro zone plate.

Abstract: A scanning probe inspector comprises: a probe that includes a cantilever and a tip whose length corresponds to a depth of a trench that is formed in a wafer; a trench detector that acquires location information of the trench using the probe, where the location information includes depth information of the trench; a controller that inserts the tip into a first point where there exists a trench based on the location information of the trench, and moves the tip through the trench using the location information of the trench; and a defect detector that detects a presence of a defect in a sidewall of the trench as the tip is moved through the trench.

Abstract: A method and device for transforming 2D images into 3D are disclosed. The disclosed device includes a dictionary storage unit configured to store a word-depth gradient dictionary; a color patch obtainer unit configured to obtain color patches from an input image; a matching word search unit configured to transform each of the color patches obtained by the color patch obtainer unit into a SIFT descriptor form and search for words closest to the SIFT descriptors of the obtained color patches from among the words of the word-depth gradient dictionary; a matching depth gradient obtainer unit configured to obtain depth gradient information of the words matching the obtained color patches from the word-depth gradient dictionary; and a depth map generation unit configured to compute a depth from the obtained matching depth gradient for each of the obtained color patches and generate a depth map.

Abstract: A method of inspecting a defect including dividing a semiconductor substrate including the plurality of dies into a plurality of inspection regions, each of the plurality of inspection regions having at least one die, the semiconductor substrate including a pattern provided thereon, obtaining an optical image from each of the plurality of inspection regions, obtaining differential images between a reference region, and comparison regions, the reference region being one of the plurality of inspection regions, the comparison regions being regions other than the reference region from among the plurality of inspection regions, determining an abnormal pixel by performing a signal analysis with respect to respective signal intensities of same-location pixels in the differential images, and designating one or more possible weak patterns by comparing the abnormal pixel with a design pattern may be provided.