Abstract: A method and apparatus for bending a substantially rigid substrate (22) having first and second portions (28, 30) interconnected by a bend region (32). The apparatus comprises first and second heated die members (60, 80). The first heated die member (60) has a longitudinal body portion (62) and an outer edge portion (64) that extends along the longitudinal body portion (62) and is substantially rounded. The second heated die member (80) has a longitudinal body portion (82) and a groove (84) that extends along the longitudinal body portion (82). The first and second heated die members (60, 80) are configured to contact the substrate (22) and are capable of bending the substrate (22) in the bend region (32) when the outer edge portion (64) of the first heated die member (60) slides into the groove (84) of the second heated die member (80). There is also a method for bending the substantially rigid substrate (22).

Abstract: A system for bending a substantially rigid substrate (22) having a first portion (28) and a second portion (30) interconnected by a bend region (32). The system comprises a first heated die member (60) and a second heated die member (60). The first heated die member (60) has a longitudinal body portion (62) and an outer edge portion (64). The outer edge portion (64) extends along the longitudinal body portion (62) and is substantially rounded. The second heated die member (80) has a longitudinal body portion (82) and a groove (84). The groove (84) extends along the longitudinal body portion (82). The first heated die member (60) and the second heated die member (80) is configured to contact the substrate (22). The first heated die member (60) and the second heated die member (80) are capable of bending the substrate (22) in the bend region (32) when the outer edge portion (64) of the first heated die member (60) slides into the groove (84) of the second heated die member (80).