Patents by Inventor Horiguchi Yusuke

Horiguchi Yusuke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive for electronic component
    Patent number: 9780068
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: October 3, 2017
    Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBH
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
  • ADHESIVE FOR ELECTRONIC COMPONENT
    Publication number: 20160190094
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Application
    Filed: March 10, 2016
    Publication date: June 30, 2016
    Applicant: HENKEL AG & Co. KGaA
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
  • Adhesive for electronic component
    Patent number: 9305892
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: April 5, 2016
    Assignees: HENKEL AG & CO. KGAA, HENKEL IP & HOLDING GMBH
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang
  • ADHESIVE FOR ELECTRONIC COMPONENT
    Publication number: 20140242757
    Abstract: An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
    Type: Application
    Filed: May 1, 2014
    Publication date: August 28, 2014
    Applicants: HENKEL IP & HOLDING GMBH, HENKEL JAPAN LIMITED
    Inventors: Sugiura Yoko, Horiguchi Yusuke, Mieko Sano, Gina Hoang