Patents by Inventor Horino Shigekazu

Horino Shigekazu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mask and manufacturing method thereof
    Patent number: 7704647
    Abstract: A mask and a manufacturing method thereof are provided. A transparent substrate having three regions is provided first. A non-transmitting layer is formed in a first region of the transparent substrate. Then, a first photoresist layer is formed on the transparent substrate, and the first photoresist layer exposes a second region of the transparent substrate. Next, a first transmitting layer is formed on the transparent substrate and the first photoresist layer. Finally, the first photoresist layer is removed. The first transmitting layer on the first photoresist layer is removed at the same time and the first transmitting layer in the second region of the transparent substrate is remained and a third region of the transparent substrate is exposed. A lift-off process is used in the mask manufacturing method of the present invention to form the transmitting layer.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: April 27, 2010
    Assignee: Au Optronics Corp.
    Inventors: Chun-Hao Tung, Chia-Tsung Lee, Hsien-Kai Tseng, Horino Shigekazu
  • Mask and manufacturing method thereof
    Publication number: 20070059611
    Abstract: A mask and a manufacturing method thereof are provided. A transparent substrate having three regions is provided first. A non-transmitting layer is formed in a first region of the transparent substrate. Then, a first photoresist layer is formed on the transparent substrate, and the first photoresist layer exposes a second region of the transparent substrate. Next, a first transmitting layer is formed on the transparent substrate and the first photoresist layer. Finally, the first photoresist layer is removed. The first transmitting layer on the first photoresist layer is removed at the same time and the first transmitting layer in the second region of the transparent substrate is remained and a third region of the transparent substrate is exposed. A lift-off process is used in the mask manufacturing method of the present invention to form the transmitting layer.
    Type: Application
    Filed: May 31, 2006
    Publication date: March 15, 2007
    Inventors: Chun-Hao Tung, Chia-Tsung Lee, Hsien-Kai Tseng, Horino Shigekazu