Abstract: Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

Abstract: Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

Abstract: Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

Abstract: Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.

Abstract: A luminaire includes at least first and second waveguides. The first waveguide has a first coupling surface extending between a first surface and a second surface opposite the first surface, and the second waveguide has a second coupling surface extending between a third surface and a fourth surface opposite the third surface. The first and second coupling surfaces define a coupling cavity. The luminaire further includes at least one light source within the coupling cavity.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with a plurality of LEDs, which emit different colors of light, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material to be absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. The LED package can have a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package provides unique dimensional relationships between the features and LED package ratios, enabling more flexibility with different applications.

Abstract: A luminaire includes at least first and second waveguides. The first waveguide has a first coupling surface extending between a first surface and a second surface opposite the first surface, and the second waveguide has a second coupling surface extending between a third surface and a fourth surface opposite the third surface. The first and second coupling surfaces define a coupling cavity. The luminaire further includes at least one light source within the coupling cavity.

Abstract: A luminaire includes at least first and second waveguides. The first waveguide has a first coupling surface extending between a first surface and a second surface opposite the first surface, and the second waveguide has a second coupling surface extending between a third surface and a fourth surface opposite the third surface. The first and second coupling surfaces define a coupling cavity. The luminaire further includes at least one light source within the coupling cavity.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can also comprise a submount with one or more LEDs, and a blanket conversion material layer on the one or more LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it will be absorbed and emitted omnidirectionally. This allows for reflected light to now escape from the encapsulant. This allows for efficient emission and a broader emission profile, for example when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio.

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

Abstract: A luminaire includes at least first and second waveguides. The first waveguide has a first coupling surface extending between a first surface and a second surface opposite the first surface, and the second waveguide has a second coupling surface extending between a third surface and a fourth surface opposite the third surface. The first and second coupling surfaces define a coupling cavity. The luminaire further includes at least one light source within the coupling cavity.

Abstract: A luminaire having a waveguide suspended beneath a mounting element, the waveguide has a first surface proximal to the mounting element, a second surface distal to the mounting element, and an edge between the first and the second surfaces. At least one cavity extends into the waveguide from the first surface to the second surface. A LED component is coupled to the waveguide so as to emit light into the cavity. LED support structures are also disclosed.