Abstract: A method of manufacturing a semiconductor device includes forming a silicon germanium layer and a N-channel transistor and a P-channel transistor over the silicon germanium layer. A beta ratio of the N-channel transistor to the P-channel transistor is about 1.8 to about 2.2. A semiconductor device is also disclosed.

Abstract: A method of manufacturing a semiconductor device includes depositing a layer over a substrate and etching the layer to form a grating structure, a cross bridge test structure and a line width measurement structure. The grating structure includes a plurality of parallel lines and one of the multiple parallel lines is connected to the line width measurement structure and the cross bridge test structure. A scatterometry test is performed on the grating structure to obtain a line width and this width is compared to a line width calculated using the line width measurement structure. A semiconductor device is also disclosed.

Abstract: A semiconductor device includes a grating structure having a plurality of parallel lines, and at least one of the multiple parallel lines is a gate electrode line of a transistor, which includes source/drain regions proximate to the gate electrode line, and vias extending to the gate electrode line and the source/drain regions. A method of manufacturing the semiconductor device is also disclosed.

Abstract: A MOS ring oscillator includes a number of serially connected inverter stages with each stage comprising a MOS transistor pair. At least one of the transistors also comprises a scatterometry grate array, which is used during manufacturing of the ring oscillator to obtain scatterometry measurements that allow polysilicon lines of the MOS ring oscillator to have widths of less than 60 nm. A method includes forming at least one grate array above a substrate, illuminating the grate array, measuring light reflected off of the grate array to generate an optical characteristic trace for the grate array, and comparing the generated optical characteristic trace to a target optical characteristic trace that corresponds to a grate array having a desired profile.

Abstract: A method of using high yielding spectra scatterometry measurements to control semiconductor manufacturing processes and systems for accomplishing same is disclosed. In one embodiment, the method comprises providing a library comprised of at least one target optical characteristic trace of a grating structure comprised of a plurality of gate stacks, the target trace corresponding to a semiconductor device having at least one desired electrical performance characteristic, providing a substrate having at least one grating structure formed thereabove, the formed grating structure comprised of a plurality of gate stacks, illuminating at least one grating structure formed above said substrate, measuring light reflected off of the grating structure formed above the substrate to generate an optical characteristic trace for the formed grating structure, and comparing the generated optical characteristic trace to the target trace.