Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.

Abstract: A probe card includes a probe seat having upper and lower dies and a probe accommodating hole, a spring probe inserted through the probe accommodating hole and including a spring sleeve having upper and lower non-spring sections, and a circuit board disposed on the upper die and having a contact pad against which the spring probe is abutted. At least one of the upper and lower dies has a stopping surface partially facing the probe accommodating hole and an extended portion inserting hole in alignment with the probe accommodating hole. At least one of the upper and lower non-spring sections has a cylinder portion abutted on the stopping surface and an extended portion inserted through the extended portion inserting hole.

Abstract: A probe card includes a probe seat having upper and lower dies and a probe accommodating hole, a spring probe inserted through the probe accommodating hole and including a spring sleeve having upper and lower non-spring sections, and a circuit board disposed on the upper die and having a contact pad against which the spring probe is abutted. At least one of the upper and lower dies has a stopping surface partially facing the probe accommodating hole and an extended portion inserting hole in alignment with the probe accommodating hole. At least one of the upper and lower non-spring sections has a cylinder portion abutted on the stopping surface and an extended portion inserted through the extended portion inserting hole.

Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.

Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.

Abstract: A multi-function probe card (40) includes a PCB (41), a plurality of probe needles (47), a counter (71) to acquire a “piece sequence parameter”, a signal-measuring device (72) via the probe needles (71) to acquire a current, and a voltage parameters etc. as well as a parametric processing system (74). The parametric processing system (74) includes an I/O unit (51)/(59), a processing unit (52), a time providing unit (55), a real time display unit (56), and a storing unit (57). Moreover, the piece sequence parameter, current parameter, and voltage parameter can be input into the processing unit (52) through the I/O unit (51)/(59). Thereafter, a parametric data structure can be set up to record and calculate in accordance with the datum and parameters, and finally to display service processes and conditions of the probe card (40) through the real time display unit (56).

Abstract: A multi-function probe card (40) includes a PCB (41), a plurality of probe needles (47), a counter (71) to acquire a “piece sequence parameter”, a signal-measuring device (72) via the probe needles (71) to acquire a current, and a voltage parameters etc. as well as a parametric processing system (74). The parametric processing system (74) includes an I/O unit (51)/(59), a processing unit (52), a time providing unit (55), a real time display unit (56), and a storing unit (57). Moreover, the piece sequence parameter, current parameter, and voltage parameter can be input into the processing unit (52) through the I/O unit (51)/(59). Thereafter, a parametric data structure can be set up to record and calculate in accordance with the datum and parameters, and finally to display service processes and conditions of the probe card (40) through the real time display unit (56).