Abstract: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the probe card. The beam panel is aligned with the probe card. After the beam panel is aligned, the aligned beam panel is temporarily affixed to the probe card. After the beam panel is temporarily affixed to the probe card, the replacement beam is affixed at a location previously occupied by the damaged beam. After the replacement beam is affixed at the location, the beam panel is removed from the probe card.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.

Abstract: A method for fabricating beams for a probe card includes dividing a large beam panel into smaller sub-panels before attaching the beams to corresponding posts on a substrate. Each sub-panel may have a sufficient number of beams to test several devices under test. The beam sub-panels may be aligned to the space transformer using alignment fiducials on the beam sub-panels that correspond to opposing alignment features formed in the space transformer or other substrate. Special tie-bars may be formed between: (1) rows, for example, of beams and the frame/frame splines (i.e., quadrant tie-bars); and (2) adjacent beams within any such rows on the beam panel (i.e., beam tie-bars). The approach may also include the use of tip tie-bars and/or tail tie-bars.

Abstract: A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the probe to determine a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes the actual vertical position of the probe to the desired vertical position.

Abstract: An approach for fabricating cantilever probes for a probe card assembly includes forming posts on conductive traces on a substrate. A beam panel having beam elements formed therein is aligned to the substrate so that the beam elements are in contact with the plurality of posts. Each beam element is in contact with a post at a portion of the beam element so that both a first end portion and a second end portion overhang the post element. Each beam element is also attached to the beam panel by the first end portion. The beam elements are bonded to the plurality of posts. The first end portion of each beam element is cut, for example using an electrode, laser ablation or by dicing, to release the beam element from the beam panel. The beam panel is then removed, leaving the beam elements attached to the posts.

Abstract: A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the probe card. The beam panel is aligned with the probe card. After the beam panel is aligned, the aligned beam panel is temporarily affixed to the probe card. After the beam panel is temporarily affixed to the probe card, the replacement beam is affixed at a location previously occupied by the damaged beam. After the replacement beam is affixed at the location, the beam panel is removed from the probe card.

Abstract: A wire cleaning system for cleaning wire configured to be wirebonded is provided. The wire cleaning system includes a chamber through which a wire configured to be wirebonded extends prior to the wire being wirebonded. The wire cleaning system also includes an energy source for removing contamination from the wire in the chamber prior to the wire being wirebonded.

Abstract: An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration.

Abstract: A wire bonding system for attaching a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system includes a frame and a bonding head attached to the frame and adapted to attach a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system also includes a laser cleaning mechanism mounted to the frame, the laser cleaning mechanism including a laser for emitting laser light adapted to irradiate contaminants on a bonding pad, the laser mechanism located on the frame so as to emit light onto a bonding pad of at least one of the semiconductor device and the substrate prior to the bonding head attaching the wire thereto.

Abstract: The present invention relates to polymer-platelet particle composites comprising at least one polyamide resin, at least one oxygen scavenging system, and platelet particles derived from at least one layered silicate material.

Abstract: An electrode for use in a wire bonding apparatus is constructed of substantially pure iridium or an iridium alloy. The electrode also has a diameter that is chosen to aid in the self-cleaning of an end of the electrode during the electronic flame-off process.

Abstract: Polymer composite materials comprising of least one polymer resin and platelet particles from at least one layered silicate material uniformly dispersed in the resin and articles prepared from the polymer composite materials. The polymer composite contains at least one polyamide resin, at least one oxygen scavenging system, and at least one layered silicate material. These polymer composite materials are especially useful for manufacturing clear polyester bottles and polyester film that are recyclable have improved active gas barrier properties to oxygen, and have improved passive barrier properties to carbon dioxide and other gases. The polymer composite materials can be used in relatively minor amounts as either a blend or a coextruded thin layer with virgin or post consumer recycled polyesters and related copolymners.

Abstract: Disclosed are amber polyester compositions suitable for packaging food and beverages wherein the compositions significantly absorbs light of wavelengths shorter than about 550 nm which is achieved by a combination of several colorants, most of which are copolymerized into the polyester.

Abstract: The present invention relates to oxygen scavenging compositions comprising a) platelet particles having attached thereto at least one oxygen scavenging organic cation and b) at least one oxidation catalyst. The oxygen scavenging compositions of the present invention maybe readily incorporated into a variety of matrix polymers to create polymer composites, which display improved passive barrier and oxygen scavenging capabilities. Articles formed from these composites are also disclosed.

Abstract: Disclosed are amber polyester compositions suitable for packaging food and beverages wherein the compositions significantly absorbs light of wavelengths shorter than about 550 nm which is achieved by a combination of several colorants, most of which are copolymerized into the polyester.

Abstract: The present invention relates to oxygen scavenging compositions comprising an oxidation catalyst and at least one polyether selected from the group consisting of unsubstituted poly(alkylene glycol)s having alkylene chains of 1 to 3 carbon atoms, substituted or unsubstituted poly(alkylene glycol)s having alkylene chains of at least 4 carbon atoms, copolymers of poly(alkylene glycol)s, blends containing poly(alkylene glycol)s and mixtures thereof. The invention further relates to polymers containing said oxygen scavenging compounds and articles made therefrom.

Abstract: The present invention relates to an apparatus and method for detecting defects in colored articles. Specifically, the present invention comprises exposing a plastic colored article to radiation in the near infrared range; measuring radiation returned from or passed through said article and analyzing said returned or passed radiation to provide defect data for said article or contents within said article.