Abstract: A contact element for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connected to each other by a separating area, such that a one-piece semi-finished part is embodied.

Abstract: A contact element for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips, which are embodied as contact tips for a contact pad of a part, connected to each other by a separating area, such that a one-piece semi-finished part is embodied.

Abstract: A contact unit is provided. The contact unit is adjusted in order to create an electric contact in a test device and comprises an arrangement for contact guides (140; 340?; 440?), and a connection unit (142; 442) with the contact unit having a predetermined breaking point (444), which is arranged in order to separate an electric contact between the contact guides of the arrangement of contact guides.

Abstract: A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one target region of the semiconductor device, and illuminating the foil with a laser to singulate from the foil a portion covering the at least one target region of the at least one semiconductor device.

Abstract: A contact element (120; 420) for producing an electric contact has a laser cut conducting plate, with the contour of the laser cut conducting plate including at least two tips (126), which are embodied as contact tips for a contact pad of a part, connected to each other by a separating area (128), such that a one-piece semi-finished part is embodied.

Abstract: A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks. Between each dividing surface of the conductor tracks and an area of the plastic housing surrounding the relevant dividing surface, as viewed in plan view of the dividing surface, a spacing is provided in each case.

Abstract: A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks.

Abstract: An apparatus for simultaneously wetting a plurality of electrical contact areas with a liquid includes a punch with nubs or studs made of an elastomer. The number, configuration and dimensions of the nubs are adapted to the contact areas to be wetted. A process for simultaneously wetting a plurality of electrical contact areas with a liquid includes wetting the nubs with the liquid, leading the punch over the contact areas in such a way that the nubs are each disposed over one of the contact areas, and subsequently transferring the liquid from the nubs onto the contact areas.

Abstract: A process for the sterilization of pumps for liquid or pasty pharmaceuticals, cosmetics, foodstuffs or similar products, preferably for pumps in which the piston can be driven to slide longitudinally in a cylinder and, at the same time, to rotate about its own axis. The piston contains a recess that reaches as far as the circular cylinder wall and the working face of the piston and communicates with a suction connection in the cylinder wall during a suction stroke and with a pressure connection in the cylinder wall during a pressure stroke and where, further, a closable drainage aperture is preferably provided in the bottom end of the cylinder. A sterilization medium is fed to a pump connection while the pump is being driven. Consequently, the pump does not have to be dismantled for sterilization purposes.