Abstract: A device or oven and a method for soldering components (34, 36) onto boards (18), with the device having at least a preheating zone (10) and a soldering zone (12), and a transport device (16), by means of which the boards (18) can be moved from one zone (10) to the next. Infrared radiators (22) extending in the transport direction (20) are disposed in the preheating zone (10) and infrared radiators (24) extending transversely to the transport direction (20) are disposed in the soldering zone (12), with the radiators radiating essentially diagonally, i.e., obliquely, the board surface. As a result, it is achieved that less radiation is absorbed on the surface of the board, or the top surfaces of the components (34, 36), than on the side walls of the corresponding components (34, 38). Moreover, according to a further feature of the invention soldering ovens are adjusted using sensors (54, 56) disposed on measuring boards (18') and in the oven (10, 12).