Abstract: A soldered cooler block, especially for a charge air cooler/coolant cooler, is constructed in a packet-type manner. Cooling channels for a liquid coolant are arranged in the cooler block in a crossways manner in first layers, and gas channels for a gas which is to be cooled are arranged in a crossways manner in second layers. The cooling channels are respectively formed by two wall areas which are arranged at a distance and by intermediate strips and connection strips that include groove profiles.

Abstract: The invention relates to a stacked-plate heat exchanger, in particular a charge-air cooler, having a plurality of elongate plates (1-3;21-23;51-53) which are stacked on top of one another and are connected, in particular soldered, to one another, which plates (1-3;21-23;51-53) delimit a cavity (55-57) for conducting a medium to be cooled, for example charge air, in the longitudinal direction of the plates, and a further cavity (63-65) for conducting a coolant, wherein the plates (1-3;21-23;51-53) have in each case one inlet port and one outlet port for the medium which is to be cooled. In order to provide a stacked-plate heat exchanger which can be produced cost-effectively and has a long service life even at high temperatures, according to the invention, at least one coolant port (14-16) extends partially around a port (12) for the medium to be cooled.

Abstract: The invention relates to a heat exchanger with at least two plate-shaped flow ducts which are in parallel to one another and at a distance from one another and have a flow connection through at least one connecting duct (8) which spans the distance. It is proposed that the at least one connecting duct (8) be formed by two self-centering tube connectors (4, 6) which can be plugged one into the other.

Abstract: The invention relates to a heat exchanger (1), in particular an air-cooled air cooler consisting of a block (2) with first (7) and second (9) flow channels, arranged in a cross-flow configuration, for a first gaseous medium that is to be cooled and a second cooling gaseous medium. According to the invention, the first flow channels (7) are connected on the inlet and outlet side to collection contairers (4) mounted on the block (2) and fins (10) are located in the second flow channels (9).

Abstract: The invention relates to a cooler (1) for a PC processor. Said cooler comprises a heat absorption area (3), a heat dissipation area (4), and a channel system (2) consisting of profiled elements and/or stamped/bent components (8) welded together. Said channel system is at least partially filled with a coolant and comprises between the channels of the channel system (2) corrugated sheets (9) that are provided in the heat dissipation area (4).

Abstract: The invention relates to a soldered cooler block, especially for a charge air cooler/coolant cooler, which is constructed in a packet-type manner. Cooling channels (2) for a liquid coolant are arranged in said cooler block in a crossways manner in first layers and gas channels (1) for a gas which is to be cooled are arranged in a crossways manner in second layers. The cooling channels (2) are respectively formed by two wall areas (3) which are arranged at a distance and by intermediate strips and connection strips (4.5) comprising groove profiles.

Abstract: The invention relates to a heat exchanger (1), in particular an air-cooled air cooler consisting of a block (2) with first (7) and second (9) flow channels, arranged in a cross-flow configuration, for a first gaseous medium that is to be cooled and a second cooling gaseous medium. According to the invention, the first flow channels (7) are connected on the inlet and outlet side to collection contairers (4) mounted on the block (2) and fms (10) are located in the second flow channels (9).