Patents by Inventor Horthense Delphine Tamdem

Horthense Delphine Tamdem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210183846
    Abstract: A processor module comprises an integrated circuit component attached to a power interposer. One or more voltage regulator modules attach to the power interposer via interconnect sockets and the power interposer routes regulated power signals generated by the voltage regulator modules to the integrated circuit component. Input power signals are provided to the voltage regulator from the system board via straight pins, a cable connector, or another type of connector. The integrated circuit component's I/O signals are routed through the power interposer to a system board via a socket located between the power interposer and the socket. Not having to route regulated power signals from a system board through a socket to an integrated circuit component can result in a system board with fewer layers, which can reduce overall system cost, as well as creating more area available in the remaining layers for I/O signal entry to the socket.
    Type: Application
    Filed: February 25, 2021
    Publication date: June 17, 2021
    Applicant: Intel Corporation
    Inventors: Jeffory L. Smalley, Thomas Holden, Russell J. Wunderlich, Farzaneh Yahyaei-Moayyed, Mohanraj Prabhugoud, Horthense Delphine Tamdem, Vijaya Boddu, Kaladhar Radhakrishnan, Timothy Glen Hanna, Krishna Bharath, Judy Amanor-Boadu, Mark A. Schmisseur, Srikant Nekkanty, Luis E. Rosales Galvan
  • Patent number: 10804631
    Abstract: A device includes a circuit board with circuit components, and first edge finger tab extending from the circuit board, and a second edge finger tab extending from the circuit board. The first edge finger tab includes electrical contacts to provide signaling to and from particular circuit components of the circuit board, and is to mate with a Peripheral Component Interconnect Express (PCIe)-compatible edge card connection mechanism of a baseboard. The second edge finger tab includes electrical contacts to provide power delivery to the circuit board, is to mate with a second edge card connection mechanism of the baseboard. In some aspects, the second edge finger tab may be a PCIe-compatible feature that is typically to prevent the device from being inserted into a legacy PCI edge card connection mechanism, or with a PCIe-compatible feature that is typically to engage a retention mechanism of a baseboard.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: October 13, 2020
    Assignee: Intel Corporation
    Inventors: Timothy Wig, Manisha M. Nilange, Thane M. Larson, Horthense Delphine Tamdem
  • Publication number: 20190296470
    Abstract: A device includes a circuit board with circuit components, and first edge finger tab extending from the circuit board, and a second edge finger tab extending from the circuit board. The first edge finger tab includes electrical contacts to provide signaling to and from particular circuit components of the circuit board, and is to mate with a Peripheral Component Interconnect Express (PCIe)-compatible edge card connection mechanism of a baseboard. The second edge finger tab includes electrical contacts to provide power delivery to the circuit board, is to mate with a second edge card connection mechanism of the baseboard. In some aspects, the second edge finger tab may be a PCIe-compatible feature that is typically to prevent the device from being inserted into a legacy PCI edge card connection mechanism, or with a PCIe-compatible feature that is typically to engage a retention mechanism of a baseboard.
    Type: Application
    Filed: June 10, 2019
    Publication date: September 26, 2019
    Applicant: Intel Corporation
    Inventors: Timothy Wig, Manisha M. Nilange, Thane M. Larson, Horthense Delphine Tamdem