Abstract: The disclosure provides a semiconductor package substrate, a semiconductor package, and a method of manufacturing the semiconductor package substrate. An embodiment of the disclosure provides a semiconductor package substrate including a base substrate including a die pad portion and a lead portion, a metal catalyst layer arranged on the base substrate, and a graphene layer arranged on the metal catalyst layer.

Abstract: A method for provisioning a NSP application in a digital interactive broadcasting environment including: A) at a headend server transmitting the AIT table, having an application provisioning descriptor including a version information and a location information of an application in a form of ATTS; and B) at a user set-top box, b-1) checking a downloaded status of the application, and comparing the application version information in the descriptor with that stored into the set-top box, b-2) if the version in the descriptor is the same with that in the set-top box and downloading of the application has been performed normally, executing the application without downloading, and b-3) if the version in the descriptor is different from that in the set-top box or if downloading of the application has been performed abnormally, accessing and downloading the application based on the location information are performed.

Abstract: There is provided a method for provisioning a network service provider application in a digital interactive broadcasting environment.