Patents by Inventor Hosei Nagano

Hosei Nagano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11035809
    Abstract: To provide a thermal diffusion factor measurement device, a thermal diffusion factor measurement method and a program capable of measuring thermal diffusion with high accuracy, even when an object to be measured has anisotropy in which thermal diffusion factors differ greatly between the in-plane direction and the thickness direction and a thick thickness. In a thermal diffusion factor measurement method, a heating location H on a tabular sample is made to generate periodically varying thermal waves and the thermal waves at a detection location S on the sample are detected by a non-contact temperature sensor. In addition, the phase delay of the thermal waves at the detection location S is detected in consideration of a detection sensitivity distribution DS of the non-contact temperature sensor and the thermal diffusion factor in the in-plane direction of the sample is measured using the phase delay.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: June 15, 2021
    Assignees: BETEL CO. LTD., NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Takaaki Awano, Kimihito Hatori, Makoto Sekine, Takahiko Kubota, Hosei Nagano, Ryohei Fujita
  • Patent number: 10753895
    Abstract: An orientation evaluation device includes: a diode laser configured to periodically irradiate a sample with light to heat the sample, the sample being carbon fiber reinforced plastics; an infrared thermography configured to detect delay in response to a change in a temperature distribution of an area of the sample, the area including a spot heated by the diode laser; and a computer configured to output information on orientation of the sample based on the delay in the response detected by the infrared thermography. The orientation evaluation device enables a non-contact and quick evaluation of the orientation of the sample.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: August 25, 2020
    Assignees: NATIONAL UNIVERSITY CORPORATION TOKAI, NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM
    Inventors: Hosei Nagano, Ryouhei Fujita
  • Publication number: 20190162683
    Abstract: To provide a thermal diffusion factor measurement device, a thermal diffusion factor measurement method and a program capable of measuring thermal diffusion with high accuracy, even when an object to be measured has anisotropy in which thermal diffusion factors differ greatly between the in-plane direction and the thickness direction and a thick thickness. In a thermal diffusion factor measurement method, a heating location H on a tabular sample is made to generate periodically varying thermal waves and the thermal waves at a detection location S on the sample are detected by a non-contact temperature sensor. In addition, the phase delay of the thermal waves at the detection location S is detected in consideration of a detection sensitivity distribution DS of the non-contact temperature sensor and the thermal diffusion factor in the in-plane direction of the sample is measured using the phase delay.
    Type: Application
    Filed: April 5, 2017
    Publication date: May 30, 2019
    Inventors: Takaaki AWANO, Kimihito HATORI, Makoto SEKINE, Takahiko KUBOTA, Hosei NAGANO, Ryohei FUJITA
  • Publication number: 20180224383
    Abstract: An orientation evaluation device includes: a diode laser configured to periodically irradiate a sample with light to heat the sample, the sample being carbon fiber reinforced plastics; an infrared thermography configured to detect delay in response to a change in a temperature distribution of an area of the sample, the area including a spot heated by the diode laser; and a computer configured to output information on orientation of the sample based on the delay in the response detected by the infrared thermography. The orientation evaluation device enables a non-contact and quick evaluation of the orientation of the sample.
    Type: Application
    Filed: June 10, 2016
    Publication date: August 9, 2018
    Applicant: NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Hosei NAGANO, Ryouhei FUJITA
  • Publication number: 20080257525
    Abstract: Disclosed is a thermal control apparatus which comprises a base plate associated with a target object in a heat-exchangeable manner therebetween, at least one heat-exchange paddle attached to the base plate in such a manner as to be selectively deployed and retracted, paddle drive means provided at an end of the base plate and adapted to drive a deployment movement and a retraction movement of the heat-exchange paddle so as to change an angle of the heat-exchange paddle, and a heat transport element provided to connect the base plate and the heat-exchange paddle.
    Type: Application
    Filed: July 12, 2007
    Publication date: October 23, 2008
    Applicant: Japan Aerospace Exploration Agency
    Inventors: Akira Ohnishi, Hosei Nagano
  • Publication number: 20060067376
    Abstract: The emissivity measuring device 10 of the present invention includes an integrating sphere 18 having an energy entering hole 12 through which radiation energy is made to enter from an infrared ray source 11, a sample hole 14 placed being opposite to an entering direction of radiation energy supplied from the energy entering hole 12 and open edge portions of which are put into contact, in a struck manner, with an object 13 to be tested, and a detecting hole 16 to which a detector 15 to detect radiation energy is attached, wherein the detector 15 detects radiation energy emitted from the object 13 to be tested being multiple-scattered by the integrating sphere 17 via the detecting hole 16 and the detected radiation energy is compared with a measured value of emissivity of a known sample in a calculation controlling means 18 to calculate emissivity of the object 13 to be tested. The temperature sensor is attached to aperture edge portions of the sample hole 14.
    Type: Application
    Filed: September 29, 2005
    Publication date: March 30, 2006
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Shozo Katsuki, Akira Ohnishi, Sumitaka Tachikawa, Hosei Nagano, Hiroaki Yamana