Patents by Inventor Ho-Seong Choi

Ho-Seong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Skateboard
    Publication number: 20100219597
    Abstract: Provided is a skateboard. The skateboard includes front and rear boards each including a foot placing unit, a directional caster including at least two connectors respectively disposed on bottom surfaces of the front and rear boards at a predetermined distance, rotating arms rotatably coupled to the connectors respectively, and wheels respectively supported by the rotating arms and rollingly contacting the ground, and a connection unit having both ends axial-rotatably and pivotally connected to one sides of the front and rear boards.
    Type: Application
    Filed: June 27, 2007
    Publication date: September 2, 2010
    Inventor: Ho Seong Choi
  • PLASMA DISPLAY PANEL AND METHOD FOR FABRICATING THE SAME
    Publication number: 20080265740
    Abstract: A plasma display panel is disclosed, which includes a first panel provided with an address electrode, a first dielectric, and a phosphor on a first substrate, and a second panel bonded to the first panel by interposing a barrier therebetween, including a transparent electrode, a bus electrode, a second dielectric provided with high dielectric particles, and a protective layer on a second substrate.
    Type: Application
    Filed: April 2, 2008
    Publication date: October 30, 2008
    Inventors: Young Han Lee, Ho Seong Choi, Sung Chun Choi
  • ANISOTROPIC CONDUCTIVE ADHESIVE MATERIAL AND DISPLAY PANEL UNIT HAVING THE SAME
    Publication number: 20070232726
    Abstract: An anisotropic conductive adhesive material and a display panel unit having the same is disclosed. The anisotropic conductive adhesive material may comprise a binder; and a conductive filler which is uniformly distributed inside the binder and is not distorted by thermal adhesion. Accordingly, the conductive filler may be uniformly distributed, thereby enhancing an electric contact quality between an electrode of a glass substrate and an FPC and reducing contact resistance.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 4, 2007
    Applicant: LG ELECTRONICS INC.
    Inventor: Ho-Seong Choi