Abstract: A wafer processing method includes supplying a first process gas into a wafer processing apparatus, lowering a temperature of the wafer, generating plasma using the first process gas, supplying a second process gas and mixing the second process gas with the plasma, performing a plasma process on the wafer using the plasma and the second process gas, and performing an annealing process on the wafer on which the plasma process has been performed. The lowering of the temperature of the wafer includes increasing an internal pressure of the wafer processing apparatus.

Abstract: A data control circuit includes a MUX driver that electrically connects a first channel of a data driver and one of the pixels in a first pixel group of a display panel in response to a first control signal, and electrically connects a second channel of the data driver and one of the pixels in a second pixel group of the display panel in response to a second control signal; and a MUX controller that outputs the first and second control signals.

Abstract: A data control circuit includes a MUX driver that electrically connects a first channel of a data driver and one of the pixels in a first pixel group of a display panel in response to a first control signal, and electrically connects a second channel of the data driver and one of the pixels in a second pixel group of the display panel in response to a second control signal; and a MUX controller that outputs the first and second control signals.

Abstract: The present disclosure relates to a method and apparatus for manufacturing a passive component for an acoustic transducer, wherein a mixture of metal oxide filler with an epoxy resin is subjected to ultrasonic wave generated and followed by an addition of a hardener to cast the passive component for the acoustic transducer. Mixing the materials with the ultrasonic wave improves the dispersion of the metal oxide filler over conventional passive components, thus enabling the passive component to have uniform surfaces, resulting in improved sound velocity and attenuation characteristics with acoustic transducers that use the passive component manufactured by the present disclosure.

Abstract: The present disclosure relates to a method and apparatus for manufacturing a passive component for an acoustic transducer, wherein a mixture of metal oxide filler with an epoxy resin is subjected to ultrasonic wave generated and followed by an addition of a hardener to cast the passive component for the acoustic transducer. Mixing the materials with the ultrasonic wave improves the dispersion of the metal oxide filler over conventional passive components, thus enabling the passive component to have uniform surfaces, resulting in improved sound velocity and attenuation characteristics with acoustic transducers that use the passive component manufactured by the present disclosure.