Abstract: Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. A heat sink comprises three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that two of the Cu layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. The heat sink has a low coefficient of thermal expansion and also has high thermal conductivity in the thickness direction because the thickness of each of the Cu layers which are the outermost layers is reduced, as compared with a heat sink of a three-layer clad structure having the same thickness and density.

Abstract: A sintered friction material for brake having a high friction coefficient, with which reduction of the friction coefficient is prevented at high temperature and stable brake performance is maintained. It comprises: a metal matrix of Ni or Ni+Fe (small amount); a solid lubricant (a); and a friction adjusting material (b) including: metal or alloy particles (b1) having an average particle size of 50 ?m or more and containing at least one selected from W, Mo, Cr, and FeW; and inorganic particles (b2) containing at least one selected from oxides, nitrides, carbides, and intermetallic compounds. An average particle size db1 of b1 and an average particle size db2 of b2 satisfy db1<db2. Dispersing, in the metal matrix, b1 and b2 satisfying particular conditions as the friction adjusting material can produce a geometrical structure (particle structure with a high filling density) suitable for preventing plastic deformation of the sintered friction material.

Abstract: Provided is a heat sink having a clad structure of Co—Mo composite materials and Cu materials, satisfying high heat-sink properties required of the heat sink for use in a semiconductor package with a frame on which a high-output and small-sized semiconductor is mounted, and preventing, when applied to the semiconductor package with a frame, crack of the frame due to local stress concentration. The heat sink has three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that the Cu layers are outermost layers on both sides thereof, the Cu layers as the outermost layers each having a thickness t1 of 40 ?m or more, the heat sink satisfying 0.06?t1/T?0.27 (where T: heat sink thickness) and t2/T?0.36/[(total number of layers?1)/2] (where t2: Cu—Mo composite layer thickness, the total number of layers: sum of numbers of Cu layers and Cu—Mo composite layers).

Abstract: Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu—Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu—Mo composite layers or comprises three or more Cu—Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu—Mo composite layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.

Abstract: Provided is a method of manufacturing a soft magnetic dust core. The method includes: preparing coated powder including amorphous powder made of an Fe-B-Si-P-C-Cu-based alloy, an Fe-B-P-C-Cu-based alloy, an Fe-B-Si-P-Cu-based alloy, or an Fe-B-P-Cu-based alloy, with a first initial crystallization temperature Tx1 and a second initial crystallization temperature Tx2; and a coating formed on a surface of particles of the amorphous powder; applying a compacting pressure to the coated powder or a mixture of the coated powder and the amorphous powder at a temperature equal to or lower than Tx1?100 K; and heating to a maximum end-point temperature equal to or higher than Tx1?50 K and lower than Tx2 with the compacting pressure being applied.

Abstract: Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. A heat sink comprises three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that two of the Cu layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. The heat sink has a low coefficient of thermal expansion and also has high thermal conductivity in the thickness direction because the thickness of each of the Cu layers which are the outermost layers is reduced, as compared with a heat sink of a three-layer clad structure having the same thickness and density.

Abstract: A sintered friction material for brake having a high friction coefficient, with which reduction of the friction coefficient is prevented at high temperature and stable brake performance is maintained. It comprises: a metal matrix of Ni or Ni+Fe (small amount); a solid lubricant (a); and a friction adjusting material (b) including: metal or alloy particles (b1) having an average particle size of 50 ?m or more and containing at least one selected from W, Mo, Cr, and FeW; and inorganic particles (b2) containing at least one selected from oxides, nitrides, carbides, and intermetallic compounds. An average particle size db1 of b1 and an average particle size db2 of b2 satisfy db1<db2. Dispersing, in the metal matrix, b1 and b2 satisfying particular conditions as the friction adjusting material can produce a geometrical structure (particle structure with a high filling density) suitable for preventing plastic deformation of the sintered friction material.

Abstract: Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu—Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu—Mo composite layers or comprises three or more Cu—Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu—Mo composite layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.

Abstract: Provided is a soft magnetic dust core having high density and favorable properties. A method of manufacturing a soft magnetic dust core includes: preparing coated powder including amorphous powder made of an Fe—B—Si—P—C—Cu-based alloy, an Fe—B—P—C—Cu-based alloy, an Fe—B—Si—P—Cu-based alloy, or an Fe—B—P—Cu-based alloy, with a first initial crystallization temperature Tx1 and a second initial crystallization temperature Tx2; and a coating formed on a surface of particles of the amorphous powder; applying a compacting pressure to the coated powder or a mixture of the coated powder and the amorphous powder at a temperature equal to or lower than Tx1?100 K; and heating to a maximum end-point temperature equal to or higher than Tx1?50 K and lower than Tx2 with the compacting pressure being applied.

Abstract: Provided is a soft magnetic dust core having high density and favorable properties. A method of manufacturing a soft magnetic dust core includes: preparing coated powder including amorphous powder made of an Fe—B—Si—P—C—Cu-based alloy, an Fe—B—P—C—Cu-based alloy, an Fe—B—Si—P—Cu-based alloy, or an Fe—B—P—Cu-based alloy, with a first initial crystallization temperature Tx1 and a second initial crystallization temperature Tx2; and a coating formed on a surface of particles of the amorphous powder; applying a compacting pressure to the coated powder or a mixture of the coated powder and the amorphous powder at a temperature equal to or lower than Tx1?100 K; and heating to a maximum end-point temperature equal to or higher than Tx1?50 K and lower than Tx2 with the compacting pressure being applied.

Abstract: A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer.

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.

Abstract: A heat sink for an electronic device includes a Cr—Cu alloy layer including a Cu matrix and more than 30 mass % and not more than 80 mass % of Cr; and Cu layers provided on top and rear surfaces of the Cr—Cu alloy layer.

Abstract: It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and excellent machinability and a method for manufacturing the alloy. In particular, since various shapes are required of the alloy for heat dissipation, a manufacturing method by using a powder metallurgy method capable of supplying alloys for heat dissipation, the manufacturing costs of which are low and which take on various shapes, is provided besides the known melting method. The alloy according to the present invention is a Cu—Cr alloy, which is composed of 0.3 percent by mass or more, and 80 percent by mass or less of Cr and the remainder of Cu and incidental impurities and which has a structure in which particulate Cr phases having a major axis of 100 nm or less and an aspect ratio of less than 10 are precipitated at a density of 20 particles/?m2 in a Cu matrix except Cr phases of more than 100 nm.

Abstract: It is an object to provide an inexpensive alloy for heat dissipation having a small thermal expansion coefficient as known composite materials, a large thermal conductivity as pure copper, and excellent machinability and a method for manufacturing the alloy. In particular, since various shapes are required of the alloy for heat dissipation, a manufacturing method by using a powder metallurgy method capable of supplying alloys for heat dissipation, the manufacturing costs of which are low and which take on various shapes, is provided besides the known melting method. The alloy according to the present invention is a Cu—Cr alloy, which is composed of 0.3 percent by mass or more, and 80 percent by mass or less of Cr and the remainder of Cu and incidental impurities and which has a structure in which particulate Cr phases having a major axis of 100 nm or less and an aspect ratio of less than 10 are precipitated at a density of 20 particles/?m2 in a Cu matrix except Cr phases of 100 nm or more.

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processability. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.