Abstract: The present disclosure relates to a hybrid deposition apparatus for gallium oxide, and a hybrid deposition apparatus for gallium oxide according to a disclosed embodiment of the present disclosure includes a gas supply assembly for supplying a source gas, a reaction gas, and a purge gas, a liquid supply assembly for supplying at least a portion of the source gas, and a chamber unit which is connected to the gas supply assembly and the liquid supply assembly and has a substrate disposed therein.

Abstract: Disclosed are lens assembly including a lens having a length in a first direction, perpendicular to an optical axis, shorter than a length in a second direction, perpendicular to both the optical axis and the first direction, on a plane perpendicular to the optical axis, and a lens barrel accommodating the lens, and having an opening in a side of the lens barrel, wherein a side of the lens in the first direction is exposed through the opening.

Abstract: A cathode active material with controlled rheological properties for lithium secondary batteries. In particular, the cathode active material for a lithium secondary battery includes: a core part comprising a lithium metal oxide; and a coating layer covering at least a portion of a surface of the core part and comprising an inorganic compound.

Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.

Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.

Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.

Abstract: A thin film-type inductor includes a body including a support member, a coil disposed. on at least one surface of the support member, and a filler embedding the support member on which the coil is disposed, and an external electrode disposed. on an external surface of the body. An insulating layer is not disposed on an edge portion of the support member and the edge portion is in direct contact with a filler. The insulating layer is only disposed on an upper surface of the coil to conform to a surface of the coil.

Abstract: A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.

Abstract: A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.

Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via.

Abstract: A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.

Abstract: Disclosed herein are a printed circuit board and a method for manfuacturing the same, the printed circuit board including: a base substrate having circuit patterns; and heat radiating vias having a donut shape, formed in the base substrate, so that the heat radiation efficiency may be improved by increasing the area of the heat radiating via.

Abstract: Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.

Abstract: A method of fabricating a semiconductor plastic package can include: providing a core board, which includes at least one pad, and which has a coefficient of thermal expansion of 9 ppm/° C. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. This method can be utilized to provide higher reliability in the connection between the semiconductor chip and the circuit board.

Abstract: A method of manufacturing a printed circuit board includes stacking a solder resist layer on one side of a carrier; forming a first circuit pattern, which includes a first electrode pad, on the solder resist layer; forming a conductive post on the first electrode pad; stacking and pressing the carrier onto an insulation layer stacked in an inner substrate, such that the conductive post faces the insulation layer; and removing the carrier. As the conductive posts are pressed into the insulation layers to implement interlayer connections, certain drilling processes for forming via holes may be omitted, so that the degree of freedom can be increased in designing the circuits, and the circuits can be made to have greater densities. As the circuit patterns are buried in the insulation layers, the board can be made thinner, and the attachment areas can be increased, to allow greater adhesion.

Abstract: A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.

Abstract: Provided is a method of preparing mesoporous carbon including iron oxide nanoparticles. The method of preparing mesoporous carbon including iron oxide nanoparticles according to the present invention includes (1) dispersing and saturating iron oxide nanoparticles on a surface of mesoporous carbon and (2) calcinating the mesoporous carbon. The mesoporous carbon including iron oxide nanoparticles prepared according to the present invention may exhibit very good adsorption of an organic material and may have advantages in economic factors and convenience due to a reduction in reaction time. Therefore, contaminant treatment efficiency may be maximized by applying the mesoporous carbon including iron oxide nanoparticles according to the present invention to an adsorbent for a water treatment.

Abstract: A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of a thermoplastic resin, and second metal foils respectively formed on the adhesive layers; applying resists having openings for forming metal posts onto both sides of the carrier; forming metal plating layers for forming the metal posts in the openings; grinding surfaces of the resists; removing the resist and forming insulation layers on both sides of the carrier; and grinding surfaces of the insulation layers. The method is advantageous in that both sides of a carrier are simultaneously layered, it is possible to prevent a substrate from warping during the process of manufacturing the printed circuit board.