Abstract: Pulsed laser drivers are disclosed comprising Gallium Nitride (GaN) power transistors for driving diode laser systems requiring high current and fast pulses, such as laser drivers for LIDAR (Light Detection and Ranging) systems. Drivers are capable of delivering pulses with peak current ?100 A, e.g. 170 A to provide high peak power, fast pulses with nanosecond rise times and nanosecond pulse duration, for driving multi-channel laser diode arrays with 40 A per channel for 120 W output per channel for a combined peak output of 480 W. For lower duty cycle, example driver circuits are disclosed comprising a high current power transistor for direct drive with drive assist. For higher duty cycle, example resonant driver circuits are disclosed comprising two high current power transistors. Implementation of resonant driver circuits with GaN technology provides fast charging for short pulse operation at higher repetition rates or for pulse code modulation.

Abstract: Overdriving a power field-effect transistor. In response to a detection that the power field-effect transistor has entered the saturation region, the gate node of the power field-effect transistor is overdriven with a higher voltage. The detection of whether the power field-effect transistor is within the saturation region is done with a sense field-effect transistor. This sense field-effect transistor uses the same epitaxial stack of semiconductor layers as the power field-effect transistor. That is, the power field-effect transistor includes a part of an epitaxial stack of semiconductor layers having a heterojunction between at least two adjacent semiconductor layers, and the sense field-effect transistor includes another part of this same epitaxial stack of semiconductor layers.

Abstract: A lateral power semiconductor device structure comprises a pad-over-active topology wherein on-chip interconnect metallization and contact pad placement is optimized to reduce interconnect resistance. For a lateral GaN HEMT, wherein drain, source and gate finger electrodes extend between first and second edges of an active region, the source and drain buses run across the active region at positions intermediate the first and second edges of the active region, interconnecting first and second portions of the source fingers and drain fingers which extend laterally towards the first and second edges of the active region. External contact pads are placed on the source and drain buses. For a given die size, this interconnect structure reduces lengths of current paths in the source and drain metal interconnect, and provides, for example, at least one of lower interconnect resistance, increased current capability per unit active area, and increased active area usage per die.

Abstract: A laminated embedded die package for a power semiconductor device, wherein a laminated body comprises a layup of a plurality of electrically conductive layers and dielectric layers. The die may be mounted in thermal contact with a leadframe. Electrical connections between contact areas of the die, external contact pads of the package and internal conductive layers are made by electrically conductive vias or microvias, formed by laser drilling of vias through the dielectric layers, which are then filled with conductive metal. A plurality of unfilled half-vias are arranged around edges of the laminated body adjacent external contact pads. Half-vias are formed by laser or mechanical drilling along scribe lines before singulation of packages. Surface plating of the half-vias comprises a solder wettable material. The half-vias are unfilled to form a wettable flank which allows for lateral wicking of solder during surface mounting, to facilitate optical inspection of solder reliability.

Abstract: A lateral power semiconductor device structure comprises a pad-over-active topology wherein on-chip interconnect metallization and contact pad placement is optimized to reduce interconnect resistance. For a lateral GaN HEMT, wherein drain, source and gate finger electrodes extend between first and second edges of an active region, the source and drain buses run across the active region at positions intermediate the first and second edges of the active region, interconnecting first and second portions of the source fingers and drain fingers which extend laterally towards the first and second edges of the active region. External contact to pads are placed on the source and drain buses. For a given die size, this interconnect structure reduces lengths of current paths in the source and drain metal interconnect, and provides, for example, at least one of lower interconnect resistance, increased current capability per unit active area, and increased active area usage per die.

Abstract: A lateral power semiconductor device structure comprises a pad-over-active topology wherein on-chip interconnect metallization and contact pad placement is optimized to reduce interconnect resistance. For a lateral GaN HEMT, wherein drain, source and gate finger electrodes extend between first and second edges of an active region, the source and drain buses run across the active region at positions intermediate the first and second edges of the active region, interconnecting first and second portions of the source fingers and drain fingers which extend laterally towards the first and second edges of the active region. External contact pads are placed on the source and drain buses. For a given die size, this interconnect structure reduces lengths of current paths in the source and drain metal interconnect, and provides, for example, at least one of lower interconnect resistance, increased current capability per unit active area, and increased active area usage per die.

Abstract: A lateral power semiconductor device structure comprises a pad-over-active topology wherein on-chip interconnect metallization and contact pad placement is optimized to reduce interconnect resistance. For a lateral GaN HEMT, wherein drain, source and gate finger electrodes extend between first and second edges of an active region, the source and drain buses run across the active region at positions intermediate the first and second edges of the active region, interconnecting first and second portions of the source fingers and drain fingers which extend laterally towards the first and second edges of the active region. External contact pads are placed on the source and drain buses. For a given die size, this interconnect structure reduces lengths of current paths in the source and drain metal interconnect, and provides, for example, at least one of lower interconnect resistance, increased current capability per unit active area, and increased active area usage per die.

Abstract: Circuit-Under-Pad (CUP) device topologies for high current lateral GaN power transistors comprise source, drain and gate finger electrodes on active regions of a plurality of sections of a multi-section transistor, and a contact structure comprising source and drain contact areas, e.g. drain and source pads extending over active regions of each section, interconnected by conductive micro-vias to respective underlying drain and source finger electrodes. Alternatively, source contact areas comprise parts of a source bus which runs over inactive regions. For reduced gate loop inductance, the source bus may be routed over or under the to gate bus. The pad structure and the micro-via interconnections are configured to reduce current density in self-supported widths of the drain finger electrodes. Example CUP device structures provide for higher current carrying capability and reduced drain-source resistance.

Abstract: Circuit-Under-Pad (CUP) device topologies for high current lateral GaN power transistors comprise first and second levels of on-chip metallization M1 and M2; M1 defines source, drain and gate finger electrodes of a plurality of sections of a multi-section transistor and a gate bus; M2 defines an overlying contact structure comprising a drain pad and source pads extending over active regions of each section. The drain and source pads of M2 are interconnected by conductive micro-vias to respective underlying drain and source finger electrodes of M1. The pad structure and the micro-via interconnections are configured to reduce current density in self-supported widths of source and drain finger electrodes, i.e. to optimize a maximum current density for each section. For reduced gate loop inductance, part of each source pad is routed over the gate bus. Proposed CUP device structures provide for higher current carrying capability and reduced drain-source resistance.

Abstract: Pulsed laser drivers are disclosed comprising Gallium Nitride (GaN) power transistors for driving diode laser systems requiring high current and fast pulses, such as laser drivers for LIDAR (Light Detection and Ranging) systems. Drivers are capable of delivering pulses with peak current ?100 A, e.g. 170 A to provide high peak power, fast pulses with nanosecond rise times and nanosecond pulse duration, for driving multi-channel laser diode arrays with 40 A per channel for 120 W output per channel for a combined peak output of 480 W. For lower duty cycle, example driver circuits are disclosed comprising a high current power transistor for direct drive with drive assist. For higher duty cycle, example resonant driver circuits are disclosed comprising two high current power transistors. Implementation of resonant driver circuits with GaN technology provides fast charging for short pulse operation at higher repetition rates or for pulse code modulation.

Abstract: Circuit-Under-Pad (CUP) device topologies for high current lateral GaN power transistors comprise first and second levels of on-chip metallization M1 and M2; M1 defines source, drain and gate finger electrodes of a plurality of sections of a multi-section transistor and a gate bus; M2 defines an overlying contact structure comprising a drain pad and source pads extending over active regions of each section. The drain and source pads of M2 are interconnected by conductive micro-vias to respective underlying drain and source finger electrodes of M1. The pad structure and the micro-via interconnections are configured to reduce current density in self-supported widths of source and drain finger electrodes, i.e. to optimize a maximum current density for each section. For reduced gate loop inductance, part of each source pad is routed over the gate bus. Proposed CUP device structures provide for higher current carrying capability and reduced drain-source resistance.

Abstract: Circuit-Under-Pad (CUP) device topologies for high current lateral GaN power transistors comprise first and second levels of on-chip metallization M1 and M2; M1 defines source, drain and gate finger electrodes of a plurality of sections of a multi-section transistor and a gate bus; M2 defines an overlying contact structure comprising a drain pad and source pads extending over active regions of each section. The drain and source pads of M2 are interconnected by conductive micro-vias to respective underlying drain and source finger electrodes of M1. The pad structure and the micro-via interconnections are configured to reduce current density in self-supported widths of source and drain finger electrodes, i.e. to optimize a maximum current density for each section. For reduced gate loop inductance, part of each source pad is routed over the gate bus. Proposed CUP device structures provide for higher current carrying capability and reduced drain-source resistance.

Abstract: Circuit-Under-Pad (CUP) device topologies for high current lateral GaN power transistors comprise first and second levels of on-chip metallization M1 and M2; M1 defines source, drain and gate finger electrodes of a plurality of sections of a multi-section transistor and a gate bus; M2 defines an overlying contact structure comprising a drain pad and source pads extending over active regions of each section. The drain and source pads of M2 are interconnected by conductive micro-vias to respective underlying drain and source finger electrodes of M1. The pad structure and the micro-via interconnections are configured to reduce current density in self-supported widths of source and drain finger electrodes, i.e. to optimize a maximum current density for each section. For reduced gate loop inductance, part of each source pad is routed over the gate bus. Proposed CUP device structures provide for higher current carrying capability and reduced drain-source resistance.