Abstract: A bonded diamond assembly and a method of forming the assembly. The assembly comprises a polycrystalline diamond wafer having a largest linear dimension of between 25 mm and 200 mm, a substrate and a bonding layer located between the diamond and the substrate and bonding them together. The bonding layer, when inspected using ultrasound using a resolution of 50 ?m, a focal length selected to inspect the bonding layer, and frequencies of 100 MHz and 30 MHz, comprises low numbers of voids extending either across the thickness of the bonding layer and low numbers of voids that do not extend across the thickness of the bonding layer.

Abstract: An apparatus has a tank with an interior for containing water, a nozzle for directing ozonated water out of the spray apparatus, and an electrolytic cell located between the nozzle and the tank. The electrolytic cell is configured to ozonate water as the water flows from the tank to the nozzle. The apparatus also includes a power source for providing electric potential to the electrolytic cell. The tank, nozzle, and electrolytic cell all are part of a single spray bottle or dispenser (e.g., like a soap dispenser).

Abstract: An apparatus has a hub including a water inlet for receiving source water, a water outlet for discharging ozonated water, and an interface between the water inlet and the water outlet. The apparatus also has a cartridge including an electrolytic cell for ozonating the source water. The electrolytic cell has a cathode, an anode comprising diamond, and a membrane between the cathode and the anode. The electrolytic cell is configured to flow source water through both the cathode and the anode. The cartridge further includes at least one cartridge port for removably coupling with the interface on the hub. The at least one cartridge port and the interface are configured to flow source water from the hub into the electrolytic cell and to flow ozonated water from the electrolytic cell into the hub.

Abstract: An apparatus has a tank with an interior for containing water, a nozzle for directing ozonated water out of the spray apparatus, and an electrolytic cell located between the nozzle and the tank. The electrolytic cell is configured to ozonate water as the water flows from the tank to the nozzle. The apparatus also includes a power source for providing electric potential to the electrolytic cell. The tank, nozzle, and electrolytic cell all are part of a single spray bottle or dispenser (e.g., like a soap dispenser).

Abstract: A system and method for disinfecting contact lenses produces ozone from the water in which the contact lenses are submerged, thus avoiding the need to supply ozone from an external source. Ozone is created by an electrolytic cell including a diamond electrode, which is submerged in the water with the contact lenses to be disinfected. The diamond electrode may include a number of fingers, and may be fabricated from a diamond blank.

Abstract: A pressure control system that controls the pressure of a fluid in a plurality of zones includes a distribution manifold, at least one main manifold connected to the distribution manifold, and at least one disposable manifold connected to the distribution manifold and the main manifold. The disposable manifold is adapted to be replaced independent of the distribution manifold and the main manifold, and is connected to each zone and to at least one vacuum source. The distribution manifold distributes the fluid to the plurality of zones, so as to cause flow of the fluid into and out of a measurement chamber located within each zone. The main manifold includes, for each zone, a pressure sensor configured to measure pressure in the measurement chamber in that zone, and a control valve configured to regulate the flow of the fluid through that zone.

Abstract: The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate.

Abstract: The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate.

Abstract: The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate.

Abstract: The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate.

Abstract: The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate.