Patents by Inventor Hosur Venkatagiriyappa Ramakrishna

Hosur Venkatagiriyappa Ramakrishna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Engineered Residue Solder Paste Technology
    Publication number: 20170135227
    Abstract: A method of forming a solder joint, the method comprising: (i) providing a solder flux; (ii) providing solder particles; (iii) providing two or more work pieces to be joined; and (iv) heating the solder flux and the solder particles in the vicinity of the two or more work pieces to be joined to form: (i) a solder joint between the two or more work pieces to be joined, and (ii) a solder flux residue. The solder flux residue substantially covers the exposed surfaces of the solder joint.
    Type: Application
    Filed: June 19, 2015
    Publication date: May 11, 2017
    Inventors: Hosur Venkatagiriyappa Ramakrishna, Morgana De Avila Ribas, Ranjit Pandher, Siuli Sarkar, Sutapa Mukherjee, Bawa Singh