Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.

Abstract: A process for preparing a phase change microcapsule having a thermally conductive shell is introduced. The thermal conductivity of the encapsulation materials for the phase change microcapsules is increased by adding thermally conductive nano-materials. The vinylsilane compound is polymerized with the acrylic monomer to form the copolymer first, and then the thermally conductive inorganic material is added. Thereafter, the phase change microcapsule having the phase change material as the core and the thermally conductive material-containing copolymer as the shell is prepared. The polar functional groups on the surface of the thermally conductive inorganic material condense with the vinylsilane compound to form chemical bonding, thereby substantially increasing the compatibility between the thermally conductive inorganic material and the copolymer.

Abstract: A method of manufacturing a microencapsulated phase-change material-containing gypsum plate capable of flame retardation and temperature variation attenuation is introduced, such that an organic microencapsulated phase-change material is uniformly distributed in an inorganic gypsum plate. The method involves putting a microencapsulated phase-change material in a dispersing agent solution, blending the dispersing agent solution to form a first solution, putting the foaming agent in the first solution, putting gypsum powder and starch in the first solution, blending the first solution to form a microencapsulated phase-change material gypsum mixture solution, molding the microencapsulated phase-change material gypsum mixture solution to finalize the manufacturing of a microencapsulated phase-change material-containing gypsum plate capable of flame retardation and temperature variation attenuation.