Abstract: A method for fabricating a semiconductor apparatus including providing a first silicon substrate having a first contact, wherein providing the first silicon substrate comprises forming a silicide layer between the first silicon substrate and a first metal layer. The method further includes providing a second silicon substrate having a second contact comprising a second metal layer and placing the first contact in contact with the second contact. The method further includes heating the first and second metal layers to form a metallic alloy, whereby the metallic alloy bonds the first contact to the second contact.

Abstract: The present disclosure provides an embodiment of an integrated structure that includes a first electrode of a first conductive material embedded in a first semiconductor substrate; a second electrode of a second conductive material embedded in a second semiconductor substrate; and a electrolyte disposed between the first and second electrodes. The first and second semiconductor substrates are bonded together through bonding pads such that the first and second electrodes are enclosed between the first and second semiconductor substrates. The second conductive material is different from the first conductive material.

Abstract: The instant disclosure relates to bi-direction data transmission method, high-frequency connector and an optical connector using the same. The optical connector includes a first circuit board, a second circuit board, a high-frequency connector and an optical fiber cable. One optical engine is set on the first circuit board. The high-frequency connector is set between the first circuit board and the second circuit board for connecting both two circuit boards. The high-frequency connector includes an insulation base. The insulation base has at least one terminal-accommodating region. Pluralities of connection terminals are inserted into the terminal-accommodating regions of the insulation base. The optical fiber cable connects to the one optical engine.

Abstract: A signal transmission connector includes an insulating body, a plurality of first terminals, a plurality of second terminals, and a rear casing. The insulating body has a dielectric constant of about 3 to 3.4. The first and second terminals are disposed on the insulating body. The first and second terminals have widths of about 0.36 to 0.42 mm. The rear casing is assembled at the second end of the insulating body. The rear casing envelops the first and the second terminals. The rear casing has a dielectric constant of about 3.5 to 3.8. The connector provides adjustable impedance without modifications to the terminal structures and also reduces cost.

Abstract: A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.

Abstract: A method of fabricating a micro electro mechanical system (MEMS) structure includes providing a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is provided and bonded with the bonding pad structure of the first substrate structure.

Abstract: An apparatus includes a bonding system configured to bond at least two wafers. The bonding system has a flag-out mechanism configured to remove a plurality of flags from an area between the at least two wafers. The apparatus also includes sensors configured to detect data related to a flag-out condition of the flags of the plurality of flag. The apparatus further includes at least one processor configured to receive inputs from the sensors, to calculate at least one value related to flag-out timing, and to drive a display indicating an alignment of the at least two wafers.

Abstract: An electrical connector module for electrically connecting at least one connector to a printed circuit board of an electronic device includes at least one shielding jack having a top wall, two opposite side walls and at least one common wall. The walls of the shielding jack collectively define at least a slot therewithin for receiving the connectors and a front end and an opposite rear end. The slot is divided by the common wall. The side walls and the common wall have a plurality of press fit terminals extending toward the circuit board. The common wall has a plurality of offset latch arms engaged with different connectors. When the connectors are inserted to the slots, the offset latch arms respectively secure the connectors in the corresponding slots.

Abstract: A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure.

Abstract: A pluggable self locking connector includes a socket having a socket case and a plug having a plug shell and a snap fit portion coupled thereto. The socket case is formed with a depression on the inner wall. The outer wall of the snap fit portion is formed with a deformable resilient rib and a bump. The plug shell is formed with an opening for receiving the resilient rib and a resilient latch corresponding to the bump. The front end of the plug shell has a resilient positioning member. When the socket and plug mate, the resilient rib slides into the depression. When the socket and the plug separate, the resilient rib is confined within the depression and the resilient latch and the bump are engaged. The front end of the snap fit portion presses the resilient positioning member and the resilient positioning member is partially exposed.

Abstract: An apparatus is disclosed for detecting flag velocity during a eutectic process for bonding two wafers. The apparatus includes a plurality of sensors for detecting a time and/or velocity of a plurality of flags within a flag-out mechanism. The apparatus also includes one or more displays displaying time durations associated with the movement of the flags during the bonding process. Also disclosed is a method of aligning wafers in a eutectic bonding process. The method includes determining one or more time durations associated with the movement of the flags in the plurality of flags. The method also includes determining if a misalignment has occurred based on the one or more time durations associated with the movement of the flags.

Abstract: A signal transmission connector includes an insulating body, a plurality of first terminals, a plurality of second terminals, and a rear casing. The insulating body has a dielectric constant of about 3 to 3.4. The first and second terminals are disposed on the insulating body. The first and second terminals have widths of about 0.36 to 0.42 mm. The rear casing is assembled at the second end of the insulating body. The rear casing envelops the first and the second terminals. The rear casing has a dielectric constant of about 3.5 to 3.8. The connector provides adjustable impedance without modifications to the terminal structures and also reduces cost.

Abstract: The instant disclosure relates to bi-direction data transmission method, high-frequency connector and an optical connector using the same. The optical connector includes a first circuit board, a second circuit board, a high-frequency connector and an optical fiber cable. One optical engine is set on the first circuit board. The high-frequency connector is set between the first circuit board and the second circuit board for connecting both two circuit boards. The high-frequency connector includes an insulation base. The insulation base has at least one terminal-accommodating region. Pluralities of connection terminals are inserted into the terminal-accommodating regions of the insulation base. The optical fiber cable connects to the one optical engine.

Abstract: An electrical connector module for electrically connecting at least one connector to a printed circuit board of an electronic device includes at least one shielding jack having a top wall, two opposite side walls and at least one common wall. The walls of the shielding jack collectively define at least a slot therewithin for receiving the connectors and a front end and an opposite rear end. The slot is divided by the common wall. The side walls and the common wall have a plurality of press fit terminals extending toward the circuit board. The common wall has a plurality of offset latch arms engaged with different connectors. When the connectors are inserted to the slots, the offset latch arms respectively secure the connectors in the corresponding slots.

Abstract: A pluggable self locking connector includes a socket having a socket case and a plug having a plug shell and a snap fit portion coupled thereto. The socket case is formed with a depression on the inner wall. The outer wall of the snap fit portion is formed with a deformable resilient rib and a bump. The plug shell is formed with an opening for receiving the resilient rib and a resilient latch corresponding to the bump. The front end of the plug shell has a resilient positioning member. When the socket and plug mate, the resilient rib slides into the depression. When the socket and the plug separate, the resilient rib is confined within the depression and the resilient latch and the bump are engaged. The front end of the snap fit portion presses the resilient positioning member and the resilient positioning member is partially exposed.

Abstract: A wafer seal ring may be formed on a first and/or a second wafer. One or both of the first and/or second wafers may have one or more dies formed thereon. The wafer seal ring may be formed to surround the dies of a corresponding wafer. One or more die seal rings may be formed around the one or more dies. The wafer seal ring may be formed to a height that may be approximately equal to a height of one or more die seal rings formed on the first and/or second wafer. The wafer seal ring may be formed to provide for eutectic or fusion bonding processes. The first and second wafers may be bonded together to form a seal ring structure between the first and second wafers. The seal ring structure may provide a hermetic seal between the first and second wafers.