Patents by Inventor Hou Boon Tan

Hou Boon Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE
    Publication number: 20080054420
    Abstract: In one embodiment, a semiconductor package includes a lead frame having a lead portion and pad portion that are offset with respect to each other. The lead portion includes a deep formed impression. An up-bent portion connects the lead portion to the pad portion.
    Type: Application
    Filed: August 23, 2006
    Publication date: March 6, 2008
    Inventors: Guan Keng Quah, Hou Boon Tan, Qiang Hua Pan
  • Method for manufacturing a semiconductor package on a leadframe
    Patent number: 6436736
    Abstract: A method of forming a semiconductor package (30) on a leadframe (20) trimmed from strip (10). Encapsulant (34) forms plastic tie bars (40) linking the semiconductor package (30) and the strip (10), to mechanically support, but electrically isolate, the semiconductor die (31) for functionality testing.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: August 20, 2002
    Assignee: Semiconductor Components Industries LLC
    Inventors: Saat Shukri Embong, Hou Boon Tan, Kuan Ming Kan
  • Leadframe structure having moveable sub-frame
    Patent number: 5920113
    Abstract: A leadframe (1) includes a main frame having longitudinal outer rails (4) and a number of sub-frame (8) separated from the main frame by a slit (6) extending around at least part of the perimeter of the sub-frame (8). A plurality of flag portions (2), on which a semiconductor die is to be mounted, extend from the mainframe and a plurality of lead portions (12) extend from the sub-frame (8) towards the flag portions (2). The sub-frame (8) is bent twice in a zig-zag fashion so as to be in a plane parallel to that of the main frame so that the corresponding flag and lead portions overlap without affecting the dimensions of the outer edge portion of the main frame.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: July 6, 1999
    Assignee: Motorola, Inc.
    Inventors: Hin Kooi Chee, Chee Hiong Chew, Hou Boon Tan, Robert J. McLaughlin, David M. Culbertson, Alex J. Elliott, Keng Guan Quah