Patents by Inventor Hou-Cheng Su

Hou-Cheng Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12211833
    Abstract: An electrostatic discharge protection structure includes a semiconductor substrate, a gate structure disposed on the semiconductor substrate, a first well region of a first conductivity type disposed in the semiconductor substrate, a first doped region of the first conductivity type, a second doped region of a second conductivity type, a third doped region of the first conductivity type, and a fourth doped region of the second conductivity type. The first and second doped regions are disposed in the first well region and connected with each other. The second doped region is an emitter of a first bipolar junction transistor. The third and fourth doped regions are disposed in the semiconductor substrate and connected with each other. The third and second doped regions are located at two opposite sides of the gate structure in a first horizontal direction. The third doped region is an emitter of a second bipolar junction transistor.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: January 28, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hou-Jen Chiu, Mei-Ling Chao, Tien-Hao Tang, Kuan-Cheng Su
  • Patent number: 10723516
    Abstract: A closure for closing a bag and a die head and method for making the closure. The closure includes two closure members having support walls and mating interlocking profiles. The support walls are resilient and have self-retaining forms in vertical section including middle sections curving outwardly away from one another when mounted on a bag. Top portions of the support walls extend outwardly away from one another to form gripping panels when the closure is closed. A die head for forming a closure member includes a body that defines a slot including a support wall segment for forming the support wall of the closure member. The support wall segment includes first and second portions oriented transverse to one another and intersecting at a vertex. To form the closure member, polymer is extruded through the slot and quenched.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: July 28, 2020
    Assignee: Inteplast Group Corporation
    Inventors: Ben Tseng, Hou-Cheng Su, Jyh-yao Raphael Li
  • Patent number: 9932150
    Abstract: A closure for closing a bag and a die head and method for making the closure. The closure includes two closure members having support walls and mating interlocking profiles. The support walls are resilient and have self-retaining forms in vertical section including middle sections curving outwardly away from one another when mounted on a bag. Top portions of the support walls extend outwardly away from one another to form gripping panels when the closure is closed. A die head for forming a closure member includes a body that defines a slot including a support wall segment for forming the support wall of the closure member. The support wall segment includes first and second portions oriented transverse to one another and intersecting at a vertex. To form the closure member, polymer is extruded through the slot and quenched.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: April 3, 2018
    Assignee: Inteplast Group Corporation
    Inventors: Ben Tseng, Hou-Cheng Su, Jyh-yao Raphael Li
  • Publication number: 20180029754
    Abstract: A closure for closing a bag and a die head and method for making the closure. The closure includes two closure members having support walls and mating interlocking profiles. The support walls are resilient and have self-retaining forms in vertical section including middle sections curving outwardly away from one another when mounted on a bag. Top portions of the support walls extend outwardly away from one another to form gripping panels when the closure is closed. A die head for forming a closure member includes a body that defines a slot including a support wall segment for forming the support wall of the closure member. The support wall segment includes first and second portions oriented transverse to one another and intersecting at a vertex. To form the closure member, polymer is extruded through the slot and quenched.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 1, 2018
    Inventors: Ben Tseng, Hou-Cheng Su, Jyh-yao Raphael Li
  • Publication number: 20180029755
    Abstract: A closure for closing a bag and a die head and method for making the closure. The closure includes two closure members having support walls and mating interlocking profiles. The support walls are resilient and have self-retaining forms in vertical section including middle sections curving outwardly away from one another when mounted on a bag. Top portions of the support walls extend outwardly away from one another to form gripping panels when the closure is closed. A die head for forming a closure member includes a body that defines a slot including a support wall segment for forming the support wall of the closure member. The support wall segment includes first and second portions oriented transverse to one another and intersecting at a vertex. To form the closure member, polymer is extruded through the slot and quenched.
    Type: Application
    Filed: July 17, 2017
    Publication date: February 1, 2018
    Inventors: Ben Tseng, Hou-Cheng Su, Jyh-yao Raphael Li
  • Patent number: D831483
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: October 23, 2018
    Assignee: Inteplast Group Corporation
    Inventors: Ben Tseng, Li-yung Chang, Jerry Hsu, Hou-cheng Su, Szu-Yu Lin, Jyh-yao Raphael Li