Abstract: Semiconductor structures and methods of forming the same are provided. A semiconductor structure according to the present disclosure includes at least one first semiconductor element and at least one second semiconductor element over a substrate, a dielectric fin disposed between the at least one first semiconductor element and the at least one second semiconductor element, a first work function metal layer wrapping around each of the at least one first semiconductor element and extending continuously from the at least one first semiconductor element to a top surface of the dielectric fin, and a second work function metal layer disposed over the at least one second semiconductor element and the first work function metal layer.

Abstract: A calibration board and a timing calibration method thereof are provided. The calibration board for calibrating signal delays of test channels in an automatic test equipment is pluggably disposed in the automatic test equipment and includes calibration groups, a first common node, and a switching module. Each calibration group includes a second common node and conductive pads electrically connecting to the second common node. Each conductive pad selectively and electrically connects to one test channel. The switching module electrically connects to the first common node and each second common node. When a first delay calibration procedure is performed, the connection between the first common node and each second common node is disabled. When a second delay calibration procedure is performed, the connection between the first common node and each second common node is built.

Abstract: A calibration board and a timing calibration method thereof are provided. The calibration board for calibrating signal delays of test channels in an automatic test equipment is pluggably disposed in the automatic test equipment and includes calibration groups, a first common node, and a switching module. Each calibration group includes a second common node and conductive pads electrically connecting to the second common node. Each conductive pad selectively and electrically connects to one test channel. The switching module electrically connects to the first common node and each second common node. When a first delay calibration procedure is performed, the connection between the first common node and each second common node is disabled. When a second delay calibration procedure is performed, the connection between the first common node and each second common node is built.

Abstract: A secure donation system is connectible to information processing device of donor, donee, and specific store via network. The system includes: a database for storing donation intention data of donor, requirement data of donee, and merchandise and/or service transaction data of specific store; a resource allocation module for generating donee data meeting donation intention data by analyzing and matching donation intention data with requirement data; a donation module for donor to choose donee from donee data meeting donation intention data generated by resource allocation module and for generating donation usage certificate after confirming donation data including donation intention data and donee data; and an authorization module for transmitting donation usage certificate to electronic device of chosen donee, so as for donee to perform verification and shopping in specific store via electronic device. Besides, a secure donation method having mechanisms of requirement matching and postpaid is also provided.