Patents by Inventor Hou Chun Wang
Hou Chun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12196695Abstract: An information handling system may include a circuit board, an integrated circuit package mounted on the circuit board, the integrated circuit package comprising: a plurality of solder balls for electrically coupling the integrated circuit package to the circuit board, the plurality of solder balls comprising a first solder ball and a second solder ball, an internal electrical coupling coupled between the first solder ball and the second solder ball, and a management controller electrically coupled to the internal electrical coupling, the first solder ball, and the second solder ball, and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether an impedance discontinuity has occurred with respect to one or both of the first solder ball and the second solder ball.Type: GrantFiled: February 17, 2023Date of Patent: January 14, 2025Assignee: Dell Products L.P.Inventors: Craig L. Chaiken, Hou-Chun Wang, Kuo-Chieh Lai, Hong-Ling Chen
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Publication number: 20240413599Abstract: An assembly, comprising a junction connector, including: a circuit board connector positioned on a first side of the junction connector; a plurality of spring loaded pins positioned on a second side of the junction connector, the second side opposite to the first side, wherein the circuit board connector is connected to the plurality of spring loaded pins; a dongle, including: an external port positioned on a first side of the dongle; and a connector pad positioned on a second side of the dongle, wherein the external port is connected to the connector pad, wherein the dongle is coupled to the junction connector such that the connector pad of the dongle is connected to the plurality of spring loaded pins of the junction connector, wherein the circuit board connector of the junction connector is configured to be coupled with a socket of an information handling system.Type: ApplicationFiled: June 12, 2023Publication date: December 12, 2024Inventors: YAOTSUNG CHANG, HOU-CHUN WANG, TSAN-WEI LIU
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Publication number: 20240280646Abstract: An information handling system may include a strain force fuse formed on a circuit board of the information handling system, the strain force fuse configured to experience an impedance discontinuity in response to a mechanical force applied to the circuit board at or proximate to the strain force fuse and a management controller electrically coupled to the strain force fuse and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether the impedance discontinuity has occurred.Type: ApplicationFiled: February 17, 2023Publication date: August 22, 2024Applicant: Dell Products L.P.Inventors: Craig L. CHAIKEN, Kuo-Chieh LAI, Hong-Ling CHEN, Hou-Chun WANG
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Publication number: 20240280524Abstract: An information handling system may include a circuit board, an integrated circuit package mounted on the circuit board, the integrated circuit package comprising: a plurality of solder balls for electrically coupling the integrated circuit package to the circuit board, the plurality of solder balls comprising a first solder ball and a second solder ball, an internal electrical coupling coupled between the first solder ball and the second solder ball, and a management controller electrically coupled to the internal electrical coupling, the first solder ball, and the second solder ball, and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether an impedance discontinuity has occurred with respect to one or both of the first solder ball and the second solder ball.Type: ApplicationFiled: February 17, 2023Publication date: August 22, 2024Applicant: Dell Products L.P.Inventors: Craig L. CHAIKEN, Hou-Chun WANG, Kuo-Chieh LAI, Hong-Ling CHEN
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Patent number: 11921543Abstract: A system and method of docking an information handling system to an intelligent wireless fan dock comprising a docking sensor to detect a docking event, a wireless module to establish a wireless link of the intelligent wireless fan dock with the docked information handling system upon detection of a docking event and to receive a dynamic fan speed request command to adjust extended fan cooling airflow from fan dock control system operating at the docked information handling system, where the fan dock control system has determined that the docked information handling system and the intelligent wireless fan dock pairing enables an increased performance mode and altered power draw limitations for the docked information handling system relative to the information handling system in an undocked state, and increasing the extended fan cooling airflow of a cooling fan based on the dynamic fan speed request command from the docked information handling system.Type: GrantFiled: April 28, 2022Date of Patent: March 5, 2024Assignee: Dell Products, LPInventors: Lee-Ching Kuo, Hong Ling Chen, Hou Chun Wang, En-Yu Jen, Chen-Yu Lin
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Patent number: 11829537Abstract: An information handling system includes a palm rest portion of a keyboard cover, a touchpad holder, and a spring plate. The spring plate includes a main frame in physical communication with the palm rest portion, and first and second spring arms in physical communication with the touchpad holder. In response to a force being exerted on any area of the touchpad holder, the first and second spring arms transition from a resting position to a clicked position.Type: GrantFiled: October 14, 2022Date of Patent: November 28, 2023Assignee: Dell Products, L.P.Inventors: Yaotsung Chang, Hou-Chun Wang, Tsanwei Liu
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Publication number: 20230350259Abstract: An information handling system may include a processor, a memory device, a power management unit (PMU), and a camera formed into a chassis of the information handling system. The camera may include a lens and an electronic image capture component, and an electrochromic glass shutter formed over the lens, the electrochromic glass shutter operatively coupled to a circuit switch to receive a voltage to change the opacity of the electrochromic glass shutter, the circuit switch operatively coupled to and controlled by an embedded controller.Type: ApplicationFiled: April 29, 2022Publication date: November 2, 2023Applicant: Dell Products, LPInventors: Hong Ling Chen, Hou Chun Wang, En-Yu Jen, Chen-Yu Lin, Lee-Ching Kuo, Shao Che Huang
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Publication number: 20230350455Abstract: A system and method of docking an information handling system to an intelligent wireless fan dock comprising a docking sensor to detect a docking event, a wireless module to establish a wireless link of the intelligent wireless fan dock with the docked information handling system upon detection of a docking event and to receive a dynamic fan speed request command to adjust extended fan cooling airflow from fan dock control system operating at the docked information handling system, where the fan dock control system has determined that the docked information handling system and the intelligent wireless fan dock pairing enables an increased performance mode and altered power draw limitations for the docked information handling system relative to the information handling system in an undocked state, and increasing the extended fan cooling airflow of a cooling fan based on the dynamic fan speed request command from the docked information handling system.Type: ApplicationFiled: April 28, 2022Publication date: November 2, 2023Applicant: Dell Products, LPInventors: Lee-Ching Kuo, Hong Ling Chen, Hou Chun Wang, En-Yu Jen, Chen-Yu Lin